Advanced precision plating for next-generation devices
Overview
Advanced Plating for AI Thermal Management, Semiconductor Packaging & Functional Materials
KIYOKAWA provides advanced plating solutions from one-piece prototypes to mass production.
• Void-Free Cu Filling for TSV/TGV
Cu filling for Si, SiC and glass, including high-aspect-ratio vias.
• Fine Bump, Pillar & RDL Plating
Fine-pitch plating with integrated processing from seed formation to stripping, up to 12-inch wafers.
• Electroless UBM & Thick Cu
Ni/Au UBM and thick electroless Cu for bonding, high-current and thermal applications.
• Selective Plating for Termal Management Components
Selective plating on Cu, Al and complex-shaped heat-dissipation substrates.
• Powder Plating for New Materials
Create new functionality by combining powders with various plated metals.
• nanoZAC® Dendritic Metal Powders
High-purity, high-surface-area, low-density powders for conductive and catalytic applications.
Bring us your toughest plating challenge.