TECNISCO, LTD.

Shinagawa-ku,  Tokyo 
Japan
http://www.tecnisco.co.jp/en
  • Booth: R8222

Overview

TECNISCO was established in 1970 as a processing service provider for precision components, taking advantage of DISCO Corporation's cutting and grinding technologies. Since then, we have developed and integrated our technology fields into a "Cross-edge" technology which crosses five leading-edge technologies such as cutting, grinding, polishing, metalizing, and bonding, thus supporting high-tech products in the industries of optical communication, industrial laser, AV/mobile, projector, automotive and medical devices.

Now, with “ The TECNISCO WAY “which clearly defined our corporate values, every single staff member of our company continuously challenges creativity and evolution. With our advanced "Cross-edge" technology, we promise that we will continue to provide first-grade products and services to our customers to become a real solution partner who can realize what our customers really want.

We will greatly appreciate your continued support and encouragement.

本公司成立於1970年，運用迪思科的研削切斷加工技術，接受精微部件的委託加工。
自公司成立以來，不斷地擴大技術領域,近年來,通過由切，削，磨，產品金屬化，鍵合這五個最先進技術匯聚而成的"Cross-edge"技術中所孕育出的產品/服務，向光通信，產業用激光，AV/移動通信，投影儀，車載器械,醫療器械市場等尖端產品領域擴展。

此外，在明確公司價值觀的“The TECNISCO WAY”的基礎上，每位公司職員都不斷進行獨創性的挑戰，養成了不斷進步的企業文化。通過我們獨創的精微加工技術，持續提供一流品質的產品和服務，當客戶提出的“這個是否也能加工?”的詢問時,我們會與客戶共同解決，實現成為真正的合作夥伴這一目標。

今後，望請各位給予更多的支持和指導。

  Products

  • Metal diamond composites （Silver diamond）
    A high‑performance material combining excellent thermal conductivity with low thermal expansion. TECNISCO’s advanced processing enables long‑lasting reliability for high‑power applications....

    • Metal diamond composites（Silver diamond）


    This material features an excellent thermal conductivity and a relatively low thermal expansion that no past materials were capable of. Combining our conventional ingenious technology and experience, we have succeeded in creating a long-lasting, reliable material beneficial for high power applications.

    Features
    Metal diamond composites (Silver diamond) make a significant contribution to improving product performance and reliability as well as extending the lifetime by offering:

    Excellent thermal conductivity
    CTE well adapted to packaging materials
    Easy integration of components into existing packages

    Tecnisco Advanced Materials (TAM)｜TECNISCO,LTD.

  • CuW submounts
    This CuW submount acts as a heat sink for high‑power LD modules, providing precise LD alignment, sharp edges, and controlled warpage for efficient thermal conduction. AuSn vapor deposition enables stable control of redundant solder on the LD bonding area....

    • This CuW submount is used as a heat sink for high power LD modules. Alignment with LD, and sharp edge and control of warpage for effective thermal conductivity are available.
    Redundant solder can be controlled in AuSn vapor deposition on the LD bonding area.

    Features

    Materials

    Composition W90/Cu10
    Thermal conductivity 170W/m・K
    CTE (coefficient of thermal expansion) 6.5ppm/℃

    Dimension/Tolerance

    Length Refer to the right table
    Width
    Thickness
    Surface roughness Ra <0.4
    Warpage 5.0μm ≦
    Edge radius 20.0μm ≦

    Metallization

    All surface Ni 1.0-5.0μm/Au 0.1-0.3μm

    AuSn solder

    Composition Au75/Sn25(wt%)
    Thickness 5μm ±1μm

    Options

    Material selection（W80 / Cu20）

    Sputtering layer（Ti, Pt, Au etc.)

    Additional structure (Hole, Step)

    Note: These are standard specifications.
    In case you have any request other than the above, please feel free to contact us

    Standard specifications（Unit：mm）

    Length（±0.05） Width（±0.05） Thickness（±0.02）
    10.6 2.0 0.20
    0.25
    0.30
    0.40
    3.0
    4.0
    5.6 5.6

    End user market / Applications

    Industrial laser

    • Laser equipment for welding, cutting, marking,
      surface treatment(e.g. annealing), etc
    • Medical laser equipment for ophthalmology and epilation, and endoscopes,etc

    Semiconductors

    • Power semiconductor devices, MPU (Microprocessing units),etc

    Digital equipment

    • Laser printers, Digital multifunction-printers,etc

    CuW submounts｜TECNISCO,LTD.

  • Insulation type Cu-AlN-Cu submounts
    This heat sink for high‑power LD modules uses a three‑layer structure for high thermal conductivity and insulation. Controlled Cu plating ensures LD matching and longer life, with high design flexibility for various applications....

    • This is a heat sink for high-power LD (Laser diode) modules. Three-layer composition achieves both high thermal conductivity and insulation quality. Control of Cu plating thickness makes the heat sink match with the LD, resulting in higher power and longer life of the LD module. Because pullback is not required on the critical edge area, it has a high degree of freedom in designing. Moreover, it can be applied to a variety of application by this freedom in design.

    Features

    AlN + Cu composite material to achieve higher thermal conductivity and insulation quality

    CTE (coefficient of thermal expansion) matching with the LD (Laser diode)

    • Adjusting Cu and AlN thickness makes it possible to control CTE

    Ideal for multi-emitting type LD

    Pullback is not required on the critical edge area

    • Ideal for P side down type LD

    AuSn/AuGe solder vapor deposition

    Easy alignment with LD on the sharp edge

    • Edge radius less than 20 μm

    Characteristics comparison data<Reference>​​​

    Unit Cu-AlN-Cu AlN CuW（10/20）
    Material features − Insulation Insulation Conductive
    Thermal conductivity W/m・K 190〜250※ 170 180/200
    CTE ppm/℃ 6〜10※ 4.6 6.5/8.3
    Electric-resistance Ω・m - - 5.3/4.0 (×10-8)
    Work voltage V <200 <200 NA
    Relative permittivity (@1 MHz) - 9 9 NA
    Dissipation factor (Tan δ ） - 5×10-4 5×10-4 NA

    ※Controllable by design

    End user market / Applications

    Industrial laser

    • Laser equipment for welding, cutting, marking,
      surface treatment(e.g. annealing), etc
    • Medical laser equipment for ophthalmology and epilation, and endoscopes,etc

    Semiconductors

    • Medical laser equipment for ophthalmology and epilation, and endoscopes,etc

    Digital equipment

    • Laser printers, Digital multifunction-printers,etc

    Insulation type Cu-AlN-Cu submounts｜TECNISCO,LTD.

  • Through glass via (TGV)
    3-dimensional wafer-level-packaging (WLP) is the most suitable for miniaturizing semiconductor devices. It also can improve the high-frequency properties of the devices with the metal via....

    • 3-dimensional wafer-level-packaging (WLP) is the most suitable for miniaturizing semiconductor devices. It also can improve the high-frequency properties of the devices with the metal via.

    Features

    Through glass via makes it possible to minimize devices

    Anodic bonding with a silicon wafer is available
    Non-adhesive process can solve the out-gas issue

    Excellent high-frequency properties, ideal for RF application

    • Low stray capacitance compared with TSV
    • Low inductance
    • Low electric-resistance (due to metal rods)

    Suitable for WL-CSP MEMS packaging

    Fine via pitch tolerance

    • Consecutive pitch ＜±20μm/φ200 mm wafer
    • Consecutive Via pitch ＜±20μm

    Available up to φ200mm wafers

    Standard specifications
    Material Borofloat 33, SW-YY
    Glass size ≦φ200mm
    Min. thickness 0.3mm
    Min. Via diameter φ0.15mm
    Hole size tolerance ±0.02mm
    Max. aspect ratio 1 : 5
    Via material Si、W（Tungsten）
    Via hermeticity ( He leak test ） 1×10-9 Pa・m3/s
    Via-Glass gap Std. 0μm〜3.0μm
    Option 1 0μm〜1.0μm
    Option 2 -3.0μm〜0μm
    Via shape Straight
    Cavity process Available
    Metallization process Available
    Bump process Available

    Note: These are standard specifications.
    In case you have any request for other than the above, please feel free to contact us.

    End user market / Applications

    AV/Mobile

    • RF-switches/relays for mobile devices such as smartphones, portable video games, digital cameras, car navigation systems,
      Pressure sensors, Gyroscopes, Acceleration sensors, image sensors

    Automotive

    • Pressure sensors, Acceleration sensors.
    • Gyroscopes,etc

    Semiconductors

    • RF-MEMS switches.
    • Image sensors,etc

    Through glass via (TGV)｜TECNISCO,LTD.

    Biotechnology/Medical

    • Pressure sensors for medical devices,etc

  • Cavity glass / Cap glass
    High‑precision cavities can be formed inside glass wafers. With a thin, transparent cavity bottom, it functions as a distortion‑free window for laser/LED transmission or oil‑immersion microscope observation....

    • Hi-precision cavities can be formed inside of the glass wafer. With transparent and thinner finish on the cavity bottom, it can work as a window which transmits laser light or LED light without distortion, or through which observation is possible by an oil immersion microscope.

    Standard specifications
    Material Glass
    Glass size ≦φ200mm
    Min. thickness 0.15mm
    Thickness tolerance ±0.01mm
    Min. cavity size φ0.1mm/□0.07mm
    Cavity shape No restriction
    Cavity size tolerance ±0.02mm
    Chipping ≦10μm
    Cavity cross-section shape Straight / Taper / Step
    Metallization process Possible on
    - Top and bottom surfaces
    - Sidewalls

    Note: These are standard specifications.
    In case you have any request other than these, please feel free to contact us.

    End user market / Applications

    Projector

    • Display devices for projectors,etc

    Semiconductor

    • RF-MEMS switches.
    • Image sensors,etc

    AV/Mobile

    • RF-switches/relays for mobile devices such as smartphones, portable video games, digital cameras, car navigation systems,

      Pressure sensors, Gyroscopes, Acceleration sensors, image sensors

    • Display devices for mobile devices such as smartphones, portable video games, digital cameras
    • Display devices for pico-projectors

    Cavity glass / Cap glass｜TECNISCO,LTD.

  • Spacer glass
    Suitable for multilayer packaging by combining with semiconductor wafers such as MEMS devices....

    • Improve bonding yield with device wafers

    Control sagging around the holes

    Minimize chipping size

    • ≦10μm is available

    Options

    Remove microcracks from machined surface to control the particles

    Prevent malfunctions in bonding with MEMS devices

    Standard specifications
    Material Glass
    Glass size ≦φ200mm
    Min. thickness 0.15mm
    Thickness tolerance ±0.01mm
    Min. hole size φ0.3mm
    Window shape upon request
    Window size tolerance ±0.02mm
    Chipping size ≦100μm
    Cross-section shape Straight / Taper / Step
    Metallization process Available

    Note: These are standard specifications.
    In case you have any request other than these, please feel free to contact us.

    End user market / Applications

    Projector

    • Display devices for projectors,etc

    Semiconductor

    • RF-MEMS switches.
    • Image sensors,etc

    AV/Mobile

    • RF-switches/relays for mobile devices such as smartphones, portable video games, digital cameras, car navigation systems

    Biotechnology/Medical

    • Analytical chips for DNA/drug-discovery-screening analyzers,etc
    • Microreactors for biochemical reaction/electrophoresis analyzers,etc
    • Bioreactors for chemical sensors, microorganism-detection sensors,etc
    • Industrial gas-detection sensors,etc

    Spacer glass｜TECNISCO,LTD.

Categories

300 Materials, Assembly
  • Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive
  • Packages; Ceramic and Other High Temp Compounds
  • Preforms; Lids
  • Scribe Tools; Saw or Dicing Blades and Accessories
  • Solder; Solder Balls and other Soldering Materials
  • Thermal Interface Materials; Heat Sinks
  • Thick Film Pastes; Materials
  • Thin Film; Dielectric Film Materials
    • 301 Materials, Chemicals & Solids
  • Spin on glass material
  • Surface protection material; coatings
    • 302 Materials, FPD
  • Spacer Materials
    • 303 Materials, Gases
  • Gases Materials
    • 304 Materials, Mask Making
  • Mask plate blanks; Glass
    • 305 Materials, Nanotechnology
  • Materials, Nanotechnology
    • 306 PV Materials
  • Consumables
    • 307 Materials, Process
  • CMP; Grind; Lap; Polish; Abrasive materials
  • Deposition Supplies
  • Deposition/Target Materials
  • Ingots
  • Plating Materials
  • Polysilicon or granular polycrystalline silicon; Crystal growing Material
  • Process Chamber Components; Graphite; Carbon Fiber Carbon (CFC); Pyrolytic Boron Nitride (PBN)
  • Quartz ware (Silicon Carbide, Fused Quartz Glass, Sapphire), Ceramic & Oxide Ceramic Fixtures
    • 308 Materials, Substrate
  • Compound Semiconductor substrates (GaAs on Silicon; GaN; InP; SiGe, etc.)
  • Diamond substrates
  • Gallium Arsenide (GaAs); Sapphire Substrates
  • Prime; Polished; Mirrored Wafers
  • Silicon on Insulator (SOI); Silicon on Sapphire (SOS); Silicon Carbide;
  • Strained silicon; Engineered Substrates
  • Substrate Materials
    • 400 Components, Parts & Accessories
  • Raw Material & Custom components; Metal
  • Raw Material & Custom components; Plastic
  • Sensors
  • Windows
    • 900 Support Products
  • Analytical Standards; Calibrators
  • Tools

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