BenQ Materials Corporation

Taoyuan,  Taiwan
http://www.benqmaterials.com/
  • Booth: M0657

Precision Materials for Semiconductor Innovation

Overview

BenQ Materials is a global leader in material science, transforming advanced materials into innovative solutions for semiconductor, electronics, mobility, healthcare, and advanced manufacturing industries. With strong expertise in precision coating, polymer engineering, and material integration, the company continuously expands material technologies into high-value industrial applications.

Semiconductor solutions cover wafer processing, advanced packaging, and micro-contamination control. Key technologies include ultra-clean CMP cleaning brushes utilizing proprietary PVA air-foaming technology to support advanced node manufacturing with reduced contamination, lower water consumption, and enhanced process stability. Advanced packaging materials include Dry Film Photoresist (DFR) with exceptional thickness uniformity and defect control for high-density redistribution layer (RDL) applications, as well as UV-curable dicing tape designed for stable processing and high-yield ultra-thin chip handling.

Additional technologies include polyolefin porous membranes for wet-process filtration and micro-contamination control, along with UV-curable adhesives engineered for precision optical and 5G/6G component assembly. Through deep integration from material design and formulation to process and application engineering, BenQ Materials enables higher yield, reliability, and next-generation semiconductor manufacturing performance.

  Products

  • CMP Wafer Cleaning Brush Roller
    CMP Cleaning Brush Roller featuring proprietary PVA Air-foam Technology for advanced semiconductor CMP processes, delivering ultra-low particles, superior self-cleaning performance, and near-zero wafer contamination....

    • The CMP Cleaning Brush Roller is a critical cleaning consumable used in the semiconductor Chemical Mechanical Planarization (CMP) process. BenQ Materials utilizes revolutionary PVA Air-foam Technology to successfully eliminate the risk of starch residue—a common concern in traditional manufacturing methods.

    Specifically engineered for advanced node processes, this product features industry-leading low particle counts and superior self-cleaning capabilities. It ensures near-zero contamination of the wafer surface while significantly optimizing production line uptime and resource utilization.
  • Dicing UV Tape
    Customizable Dicing Tape designed for wafer dicing processes, providing secure fixation, die stability, and seamless pickup performance for high-efficiency semiconductor manufacturing....

    • Dicing Tape is engineered to provide high-efficiency protection and structural support during the wafer dicing process. It securely fixates the wafer during cutting, maintains die stability post-dicing, and facilitates seamless pickup during subsequent die-attach stages.

    Our solutions are fully customizable to meet the specific process requirements of our clients.
  • Dry Film PR
    Dry Film PR for advanced packaging applications, featuring high resolution, excellent CD control, superior lamination, and stable developing performance for fine-line circuitry and high-density RDL processes....

    • Dry Film PR for Advanced Packaging features high resolution and exceptional critical dimension (CD) control, making it ideal for fine-line circuitry and high-density Redistribution Layer (RDL) processes.

    The product offers superior lamination performance, thickness uniformity, and stable developing characteristics. By effectively enhancing patterning precision and process yield, it meets the rigorous demands of advanced packaging and high-end substrate applications.
  • UV Adhesive
    UV-Curable Adhesive featuring rapid curing, low shrinkage, and high bonding strength for semiconductor packaging, optoelectronics, and precision bonding applications requiring high reliability and manufacturing efficiency....

    • Our UV-Curable Adhesive features rapid curing, low shrinkage, and exceptional bonding strength, effectively enhancing assembly efficiency and structural stability.

    Engineered for high thermal and moisture reliability, this product is ideal for semiconductor packaging, optoelectronic components, and precision bonding applications, meeting the rigorous demands of high-precision and high-yield manufacturing processes.
  • Micro Contamination Control Film
    Polyolefin Porous Membrane for semiconductor filtration, designed for ultra-precise micro-contamination control with high porosity, high throughput, and exceptional particle retention for advanced semiconductor manufacturing processes....

    • Leveraging BenQ Materials’ deep expertise in materials science, we have successfully expanded our core technologies from optical films to critical semiconductor manufacturing.

    Our Polyolefin Porous Membrane for Semiconductor Filtration is engineered for ultra-precise micro-contamination control. Featuring high porosity coupled with microscopic pore structures, this membrane delivers high throughput and exceptional retention rates, providing a robust solution for the rigorous filtration demands of the semiconductor industry.

Categories

207 Equipment, Process
  • Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
    • 300 Materials, Assembly
  • Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive
    • 302 Materials, FPD
  • Alignment Film Materials
    • 501 HVAC, Temperature, Humidity, Contamination Control
  • Contamination Control; HEPA Filtering Systems

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