YUJAY Technology Inc.

- 單次可處理多片或批次材料，可根據材料、產能定制。處理溫度低於45℃，可滿足不同溫度要求，不對清洗產品造成溫度影響。

- 提供大氣與真空電漿清潔、活化與改質材料表面，提升附著與潤濕性，可整合於產線。

- 多樣化清潔模式，噴頭式等離子提供局部精準表面處理，寬幅等離子則適合大面積高效處理。

-大氣電漿處理範圍適用小到 D=2mm，大到寬 1520mm；真空電漿批次處理提供60L-3000L腔體設計。

- 依客戶產品需求可搭配中頻/射頻/微波電源，亦提供全自動多元化監測系統。

• High-Batch Processing & Low-Temperature Safety

  Supports single or batch processing of multiple substrates, fully customizable based on material properties and throughput needs. Operates at low temperatures (below 45°C) to meet diverse thermal requirements without causing thermal damage or affecting the products being cleaned.

• Advanced Surface Engineering

  Provides atmospheric and vacuum plasma cleaning, activation, and modification to enhance surface adhesion and wettability, with seamless inline automated production integration.

• Versatile Cleaning Modes

  Offers diverse processing modes: nozzle-type plasma delivers precise localized surface treatment, while wide-format plasma enables high-efficiency, large-area coverage.

• Flexible Processing Scales & Specifications

  • Atmospheric Plasma: Coverage ranges from localized spot treatment ($D = 2\,\text{mm}$) up to wide-format substrates ($W = 1520\,\text{mm}$).

  • Vacuum Plasma: Batch chamber capacities available from 60L to 3000L.

• Tailored Power & Smart Monitoring

  Configurable with Medium Frequency (MF), Radio Frequency (RF), or Microwave (MW) power supplies based on customer requirements, equipped with a fully automated, multi-parameter process monitoring system.

• High-Precision Gas Control & Uniformity

  Features a high-precision gas flow monitoring system with dual-channel or multi-channel process gas configurations, ensuring comprehensive and uniform surface cleaning.

• High Customizability & Factory Automation

  Highly customizable hardware and software architectures, engineered for direct integration into automated manufacturing lines

- 高精度氣體流量監測系統，採用雙路或多路製程氣體，全方位均勻清洗

- 可高度客製，整合自動化作業。
 

- 採用高強度航空鋁合金，高精度可調節腳座,穩定可靠。

- 特殊的光源導光設計， 可實現光路平行均勻照射，降低光源對成像造成的影響。搭配日本進口工業sony晶片，USB3.0高速傳輸，使用便捷，相容性高，不丟失數據。

- 使用用德國萊卡多層精工和鍍膜技術的高保真遠心變倍變焦鏡頭， 無畸形、 無失真， 0.5-8倍連續變倍變焦功能。

- 提供標準系列、科研系列、全自動旗艦系列、手持式與大尺寸系列。具備基礎特性分析，適用於產品品質管控。進階功能如滾動滑落角、高溫高壓、上視角量測、雙視角量測、滯溜力分析則更適合學術研究領域。

- 八大軟體分析功能：靜態接觸角分析、動態接觸角分析、表面自由能分析、表面張力、自動生成數據報告、粘附功分析、在線接觸角分析、鋪展尺寸分析。

Advanced Optical Contact Angle & Surface Analysis System

• Robust & Stable Construction Engineered with high-strength aviation-grade aluminum alloy and equipped with high-precision adjustable feet, ensuring exceptional stability and structural reliability.

• Advanced Optical & High-Speed Imaging System Features a proprietary light guide design that delivers parallel, highly uniform illumination, minimizing lighting interference on image acquisition. Integrated with an original Japanese Sony industrial sensor and USB 3.0 high-speed transmission, offering seamless plug-and-play usability, high compatibility, and zero data packet loss.

• High-Fidelity Telecentric Optical Lens Utilizes high-fidelity telecentric continuous zoom optics (0.5X–8X) featuring German Leica multi-layer precision coating technology. Delivers distortion-free and loss-free imaging across the entire magnification range.

• Comprehensive Product Lineup & Versatile Applications Available in Standard, Research, Fully Automated Flagship, Handheld, and Large-Format series. Ideal for quality control (QC/QA) with basic surface property characterization, as well as advanced academic and industrial R&D applications, including roll-off/sliding angle, high-temperature & high-pressure environments, top-view measurement, dual-view measurement, and retention force analysis.

• 8 Core Software Analysis Modules

  • Static Contact Angle Analysis

  • Dynamic Contact Angle Analysis

  • Surface Free Energy (SFE) Analysis

  • Surface Tension Measurement

  • Automated Data & Report Generation

  • Work of Adhesion Analysis

  • Real-Time / Online Contact Angle Monitoring

  • Spreading & Wetting Area Analysis

- 非接觸除塵，不產生任何物理、化學變化，不造成產品損傷。

- 清潔效率：3um particle >97%; 6um particle >98%。

- 主機與除塵頭搭配方案：一對一，一對二，二對二。

- 封閉系統設計，以內部循環的乾淨空氣為介質，不會破壞無塵室氣流平衡造成二次污染。

- 有效寬度 100mm-1000mm。可客製化最大有效寬度 2600mm。

- 專為卷材行業設計的弧形除塵頭，可整合在滾軸上處理膜材，為下一製程提供表面清潔。

Non-Contact Dust Removal & Surface Cleaning System

• Non-Contact & Zero-Damage Cleaning

  Delivers non-contact particle removal without inducing any physical or chemical changes, ensuring zero risk of surface damage or scratching to delicate products.

• High-Efficiency Particle Removal

  • 3um particles: >97%

  • 6um particles: >98%

• Flexible Generator & Cleaning Head Configurations

  Configurable setup options to match production requirements: 1-to-1, 1-to-2, or 2-to-2 (Generator-to-Head) system matching.

• Closed-Loop Clean Air System

  Features a closed-loop system utilizing recirculated clean air as the medium. Prevents disruption to cleanroom airflow balance and eliminates secondary environmental contamination.

• Scalable Effective Widths

  Standard effective cleaning widths range from 100mm to 1000mm, with custom engineering available for large-format applications up to 2600mm.

• Optimized Web/Roll-to-Roll Integration

  Specially designed curved cleaning heads engineered for web-handling industries. Able to mount directly over rollers to clean film/substrate surfaces prior to downstream processing.

- 真空設備包含 PVD/CVD/ALD/Evaporator。

- 自製多靶共焦濺鍍與磁控濺鍍系統，可濺鍍金屬電極、金屬氧化物、合金材料，鍍膜均勻性 <5%。可依需求設計立式或臥式濺鍍模式。

- 為既有真空腔體提供抽氣系統設計與解決方案。

- 極限真空可達 <4.0E-07 Torr

- 真空漏率  <5.0E-10 TorrL/s @He

- 基板具有加熱功能 Max. 800C

Advanced Thin Film Deposition & Vacuum Systems
Comprehensive Deposition Equipment Portfolio

Provides a full range of thin film equipment, including PVD, CVD, ALD, and Evaporator systems.

In-House Sputtering Systems & Custom Design

Features proprietary multi-target confocal sputtering and magnetron sputtering technologies capable of depositing metal electrodes, metal oxides, and alloy materials with the film uniformity of <5%. Custom designs available in both vertical and horizontal sputtering configurations.

Pumping System Integration & Solutions

Delivers complete vacuum pumping system engineering and customized solutions for existing vacuum chambers.

Ultra-High Vacuum Performance

Ultimate Vacuum: <4.0E-07 Torr

Vacuum Leak Rate: <5.0E-10 Torr L/s @ He

High-Temperature Substrate Heating

Equipped with high-precision substrate heating capabilities reaching up to max. 800C.

- 採用氦氣質譜儀與氫氦通用質譜儀對設備或管路測漏，超快清氦。

- 啟動時間 ≦2min, 反應時間 ≦1s

- 漏率顯示範圍：1.0E-03—1.0E-13 Pa•m3/s

- 三種顯示模式切換 (Pa·m3/s 、mbar·l/s、atm·cc/s)，氫、氦一鍵切換

- 推車結構，方便移動

- 可為各行業客制化測漏設備，已廣泛應用於汽車工業、液冷行業、新能源、真空行業、半導體行業需求，為產業提供高精密洩漏檢測解決方案，嚴格控管產品品質。

High-Precision Leak Detection Systems & Solutions

• Dual-Gas Detection & Fast Purging

  Utilizes helium mass spectrometers and universal hydrogen-helium mass spectrometers for precision leak testing of equipment and piping systems, featuring ultra-fast helium purging/clearance capability.

• Rapid Startup & Real-Time Response

  • Startup Time: ≦2min

  • Response Time: ≦1s

• Wide Detection Range & Flexible Display

  • Leak Rate Measurement Range: 1.0 E-03 to 1.0 E-13 Pa•m3/s

  • Multi-Unit Switching: Seamless toggle between three standard display units Pa·m3/s , mbar·l/s and atm·cc/s

  • One-Touch Gas Switching: Quick, one-key switching between Hydrogen and Helium tracer gases

• Mobile Cart Design

  Built on a durable cart structure for easy maneuverability and flexible deployment across workshop environments.

• Custom Solutions Across Key Industries

  Delivers fully tailored leak detection equipment and turnkey solutions. Widely deployed in automotive, liquid cooling, new energy, industrial vacuum, and semiconductor sectors to provide high-precision quality assurance and strict defect control.