Chip Shine Electronics Technology Co.,Ltd

上海,  Shanghai 
China
http://www.chipshine.com
  • Booth: I2125

Overview

Founded in 2002, CHIP SHINE is an innovative tech enterprise integrating R&D, design, production and sales of probes and test sockets, with over 20 years of expertise in the testing industry. Boasting a team of over 180 employees (nearly 30% are professional R&D staff), the company has an R&D and testing center and collaborates with renowned domestic universities. Its 8,000-square-meter factory is equipped with nearly 100 precision machining devices, covering precision turning (mirror turning), spring forming, fully automated assembly, vacuum heat treatment and electroplating. With an annual output of over 100 million components, the equipment processes workpieces of 0.05-20mm with a precision of 0.001-0.005mm, applicable to copper, steel, aluminum alloy, PTFE and other materials.

CHIP SHINE's core business is the R&D and production of various test probes, test modules and electrical continuity connectors, including ICT, semiconductor and photovoltaic test probes, WLP/FT semiconductor package and burn-in test probes with matching modules and solutions, as well as aerospace test cables, connectors and ultra-miniature precision springs.


  Products

  • 011 series Semiconductor Test Probe
    CHIP SHINE's semiconductor series test probes feature a minimum diameter of 0.11 mm, suitable for testing various packaged chips....

  • Mechanical Specifications:

    Full Travel: 0.60mm

    Recommend Travel: 0.40mm

    Spring Force: 7g±20%@0.40mm

    Mechanical Life: 100K

    Operating Temp: -45~125℃

    Current: 0.3A

    Resistance: 500mΩ


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