Welcome to DETEKT Technology Inc.
Overview
Precision Printing Systems
Detekt Technology | 3D Printing Precision Advanced Semiconductor Packaging
Detekt Technology specializes in 3D printing precision advanced semiconductor packaging and medical manufacturing technologies, creating highly customized solutions. Especially, 3D printing precision advanced semiconductor packaging is our recent technological developments. The followings are the introductions of the techniques.
Vertical Interconnect
In the past, wire bonding was a technique for connection between the pins, however, it existed some limits such as high pin density and larger spatial usage. Thus, vertical interconnect is a new method to overcome the problems described above, which could apply in high pin density and lower spatial usage.
Combination of our 3D precision printing and the thought of vertical interconnect, we achieve the idea by micro metallic bridge and overcome the height difference. It offers borderless design, ultra-fine interconnection, and high reliability.
Wafer Edge Side Coating
The edge of wafer exists warpage owing to the process, which leads to difficulties in printing. We develop a technique – patrolling the edge by using laser/vision, followed by generating 3D warpage map and calculating compensation, then adaptive ink printing – that could prevent the damage of the nozzle and also achieve the uniform printing.
Repair and Rework
Repair/Rework is a crucial technology in semiconductor manufacturing and packaging applications, which contains targeting the detection, location, and repairing in substrates. Through precision inspection and metal wire repairing by ultra-precision printing, it could reduce the rate of scrap, improve product yield, and extend the life time of the products.
Repair/Rework could apply in the situations such as local defects discovered after the wafer fabrication process, the products experienced a partial functional failure during the testing phase, and packaged components failed and needed to be replaced or repaired.