ADVANCED GLOBAL ALLIANCE PTE LTD

AGA provides integrated manufacturing and test solutions for advanced packaging and power semiconductor applications. Our portfolio includes high-precision assembly, bonding and dispensing; low-void vacuum soldering, pressure sintering and diffusion soldering; ultrasonic metal welding for robust, low-thermal-stress interconnects; X-ray inspection and functional testing; semiconductor joining materials and carriers; plus factory automation and ESD control. Our key advantage is the ability to support the complete production journey—from application analysis and process development to customized equipment, system integration, commissioning and after-sales service. By combining global technology partners with local engineering support across Asia Pacific, AGA helps customers improve interconnect reliability, process consistency, traceability, throughput and production scalability for demanding power modules and advanced device packages.

SCHUNK Sonosystems ultrasonic metal welding solutions provide solid-state, solder-free joining for advanced power electronics, EV batteries, wire harnesses and cooling systems. Pressure and high-frequency vibration create strong, homogeneous Cu, Al and selected Cu-Al joints without melting or added solder, flux, adhesive or filler. Applications include power-module terminals, busbars, shunts, DBC/ceramic substrates, leadframes, PCB contacts, pins, rivets, battery foils, tabs, BMS assemblies and high-current connections. Key advantages include low thermal input, short cycle times, high conductivity, repeatable weld quality, mixed-material capability and reduced stress on heat-sensitive components. SCHUNK platforms support process monitoring, data capture, traceability, SECS/GEM connectivity and automated line integration. AGA provides application analysis, feasibility trials, tooling, process development, system selection, commissioning and local technical support across Asia Pacific.

Schunk Aluminium Graphite (ALG) is a lightweight aluminium–synthetic graphite metal-matrix composite for power electronics thermal management and semiconductor back-end tooling. Its tailored coefficient of thermal expansion (CTE), high in-plane thermal conductivity and low density help reduce thermal stress, spread heat uniformly and lower weight. Applications include base plates, heat sinks, heat spreaders, interposers, housings, submounts, soldering and sintering fixtures, jigs, carriers, downholders and hybrid assemblies. ALG tooling supports substrate attach, die/component attach, leadframe and terminal alignment, workpiece handling and double-sided cooled power modules. Customer-specific machining enables pockets, holes, alignment, clamping, vision, robotic-interface and traceability features. Multiple ALG grades support different thermal and mechanical requirements. AGA provides material selection, design review, prototyping, manufacturability support and technical service.

Infotech provides modular automation for semiconductor packaging, microassembly and power electronics. Its portfolio includes Die Bonder and Hybrid Bonder platforms for die attach, SMD assembly, flip-chip, eutectic and thermocompression bonding, plus pre-sintering and Sinter Bonder development. Configurable Pin Attacher and precision Dispensing modules support adhesives, conductive epoxy, solder paste, sinter paste, underfill and glob top. Vision-guided alignment, wafer handling, force and temperature control, traceability and inspection enable repeatable processes. The Component Matrix combines bonding, dispensing, feeding, handling, testing and inspection on one scalable architecture. Customers can start with a Desktop system for R&D, feasibility studies and prototyping, then transfer qualified recipes to Production Cells or Production Lines. AGA supports application trials, process development, system configuration, line integration and local technical service across Asia Pacific.

PINK Sintering Technology provides vacuum-assisted pressure sintering and diffusion soldering for high-reliability power electronics and semiconductor packaging. The SIN series supports Ag/Cu die attach, clip sintering, multilayer sintering, substrate-to-baseplate and package-to-cooler assembly for SiC, IGBT and high-power devices. Hermetically sealed chambers with controlled N₂, H₂ or HCOOH atmospheres help reduce oxidation, remove residues and stabilize copper surfaces. Dynamic force control, programmable heating and cooling up to 350°C, recipe management and process traceability enable repeatable joint quality. Flexible Softtool, Hardtool and custom tooling support different layouts, die heights and production needs. Platforms scale from compact SIN 20 R&D systems to SIN 50+, SIN 100 Multi Drive and high-force SIN 200+ modular inline production. AGA supports feasibility studies, tooling, process development, automation integration, commissioning and regional technical support.

PINK Soldering Technology provides VADU vacuum soldering systems for low-void, reproducible joints in power electronics, semiconductor packaging, automotive and e-mobility. Vacuum during the liquid solder phase removes gas inclusions and improves thermal and electrical connection quality. VADU supports solder preforms and pastes, flux-free formic acid processes, inert protective gas with residual oxygen below 5 ppm, programmable profiles, controlled temperature gradients, rapid heating and cooling, and process temperatures up to 400°C as standard. Applications include die attach, substrate-to-baseplate, power modules, hybrid assemblies, wafers, leadframes and multilayer packages. The portfolio scales from VADU 100 R&D and small-series batch production to VADU 200XL wafer-capable systems and modular inline platforms with 2–5 chambers. Options include MES/SECS-GEM, SMEMA, traceability, high vacuum, induction heating, customized carriers and automated handling.