Glint Materials Co. Ltd

SurfCon® 

Bio-Inspired Innovative Non-Slip Pad for Semiconductor Wafer Handling

Glint Materials has been the first pioneering company developing and manufacturing bio-inspired dry adhesive pads

especially for semiconductor industry that requires precise substrate handling. Our top priority is to contribute customers' success

and continuous improvement. Please feel free to contact us with your problems over semiconductor wafer handling.

We will do our best to resolve your problems.

SurfCon® Innovative Dry Adhesive Non-Slip Pad
High performance dry adhesive non-slip pad specialized for semiconductor and display substrate handling... More Info Less Info




① High performance dry adhesive non-slip pad specialized for semiconductor and display substrate handling
② Strong horizontal friction force but less stickiness (Popping Free)
③ Manufactured with semiconductor compliance material (POLMA®, CONEPOL®)
④ Proven quality performance by major IDMs and global equipment makers
⑤ Reasonable price, fast delivery and longer friction lifetime