AI Technology, Inc.

Princeton Junction,  NJ 
United States
http://www.aitechnology.com
  • Booth: L0808

Categories

300 Materials, Assembly
  • Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive
  • Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools
  • Molding; Encapsulation; Potting; Resin Materials
  • Package Substrates; Laminate; Film based
  • Solder; Solder Balls and other Soldering Materials
  • Tape Automated Bonding (TAB) Accessories
  • Thermal Interface Materials; Heat Sinks
  • Thick Film Pastes; Materials
  • Thin Film; Dielectric Film Materials

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