JTEKT THERMO SYSTEMS TAIWAN CO .,LTD

These clean ovens can accommodate not only φ300 mm wafers but also large square substrates measuring up to 310 × 310 mm, 510 × 515 mm, and 600 × 600 mm.

The systems are suitable for a wide range of thermal processes, including the treatment of silicon and glass interposers, RDL (Redistribution Layer) processing, reflow after solder bumping, and firing after resin molding.

Leveraging the temperature and atmosphere control technologies, as well as substrate handling expertise developed for large LCD display substrate thermal processing systems, we contribute to the thermal processing requirements of advanced semiconductor packaging.

Excellent temperature controllability in low-temperature ranges and high process reproducibility enable uniform and stable oxidation treatment. As a key system supporting the production of high-quality devices, we have achieved one of the highest levels of sales performance in the industry.

Its proprietary debinding process utilizing superheated steam suppresses thermal shock and cracking while achieving high-quality debinding results. In addition, the system can reduce processing time by up to 70% compared with conventional processes.