Kenner Material & System Co., Ltd

Guanyin Dist,  Taoyuan City 
Taiwan
http://www.kenner.com.tw
  • Booth: Q5133

Overview

Kenner has been incorporated since 2000. We specialize in polymeric material development for information and communication industries. With experienced and dedicated personnel, Kenner has developed a number of outstanding products. They are, KennElec for electrically conductive sheet and antistatic applications and KennTherm for thermally conductive applications.

  Products

  • COVER TAPE（上封帶、上膠膜）
    優異抗靜電及抗熱沾黏，剝離靜電壓低於20V，拋料率極低，膠面非塗佈製程，無析出以及元件汙染風險，適用以下產業領域包裝：
    a. 砷化鎵（GaAs）產業鏈，包括手機射頻元件、光通訊及AI 資料中心光通訊模組及低軌衛星元件等。
    b. 小尺寸積體電路 (SoIC)：相較傳統DIP元件，體積縮減達 30–50%，厚度減少 70%，適合採用本包裝用上帶。
    c. QFN / WLCSP：微處理器與觸控 IC，晶片尺寸覆晶封裝 (WLCSP) ，等同裸晶大小的極小化產品，適合採用本包裝用上帶。
    ...

    • 優異的抗靜電及抗熱沾黏性，剝離靜電壓低於20V，拋料率極低，膠面非焊接工藝，無解析出以及元件污染風險，適用以下產業領域包裝
    ：
    b 小尺寸積體電路(SoIC)：採用傳統DIP元件，體積縮小達30–50%，厚度減少70%，採用適合本包裝用上帶
    。 QFN / WLCSP：與圖形IC，晶片尺寸覆晶封裝
    ( WLCSP)，接著裸晶尺寸的極小化產品，適合使用本包裝用上帶。 被動元件小型尺寸元件：包含0402至01005以下尺寸，電阻、電容、電感等電子產品紙帶封裝上帶。
  • ESD Bag（抗靜電袋）
    符合ANSI/ESD S20.20 2021規範，內層抗靜電非塗佈製程，無出油、出粉風險：
    A. Moisture Barrier Bag （MBB；抗靜電鋁箔袋）
    B. Static Shield Bag （SSB；屏蔽袋）
    C. Zipper Bag （夾鏈袋）
    ...

    1. 符合ANSI/ESD S20.20 2021規範，內層抗靜電非塗佈製程，無出油、出粉風險：
      A. Moisture Barrier Bag （MBB；抗靜電鋁箔袋）
      B. Static Shield Bag （SSB；屏蔽袋）
      C. Zipper Bag （夾鏈袋）
  • Electrically conductive and ESD compounds
    KennElec Compound
    KennElec electrically conductive and ESD compounds provide permanent protection from static buildup。
    KennElec compounds can be easily processed by injection molding and extrusion。
    ...

    • KennElec Compound

    KennElec electrically conductive and ESD compounds provide permanent protection from static buildup。

    KennElec compounds can be easily processed by injection molding and extrusion。

    KennElec compounds are designed to have balanced mechanical properties for appliances，electronics packaging and handling 。

    Features

    • Conductive Permanently Antistatic，Dissipative Grades Available
    • Good Process ability
    • Good Dimensional Stability
    • Good Stiffness / Toughness Balance
    • Low Plough-Out
    • Transparent Grade Available

Categories

202 Equipment, General Use
  • Sealing; Bagging; Packing Equipment
    • 300 Materials, Assembly
  • Packages; Plastic
  • Thermal Interface Materials; Heat Sinks
  • Thick Film Pastes; Materials
  • Thin Film; Dielectric Film Materials
    • 308 Materials, Substrate
  • Thin & Thick film substrates for MEMS
    • 400 Components, Parts & Accessories
  • Raw Material & Custom components; Plastic
    • 602 Manufacturing Software
  • Manufacturing Execution Software (MES)

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