Kenturn has developed a series of specialized spindles for the front-end process of semiconductors, covering processes such as wafer slicing, edge grinding, thinning and grinding, and edge polishing.
Aerostatic spindle and aerostatic rotary table are used for wafer thinning and grinding,
performing double-sided grinding on the wafers to remove slicing marks on the wafer
surface while simultaneously improving the Total Thickness Variation (TTV).