Latent Technologies Inc.

Leveraging its expertise in high-temperature materials and crystal growth processes, Latent’s business scope extends across the semiconductor value chain from upstream materials to equipment solutions. Its portfolio includes crystal growth furnaces, graphite materials, crucibles, wafer inspection systems, automation equipment, and critical components such as sensors and valves. The company also provides graphite purification and gas recycling systems, building strong capabilities in advanced process integration.

In 2018, Latent introduced Taiwan’s first PVA graphite purification systems, further strengthening its material processing expertise. In 2020, the company established its wholly owned subsidiary, LEAP Semiconductor Corp., to expand into SiC materials. LEAP focuses on SiC wafers, epitaxial (epi) wafers, and related process services. Through this strategic expansion, the group has built a solid foundation covering materials, crystal growth, wafer processing, and epitaxy within the SiC supply chain.

Latent is positioned as a key solution provider in the SiC ecosystem, driven by its strengths in equipment integration and process technology. Meanwhile, LEAP Semiconductor enhances the group's capabilities on the materials and wafer side. Together, they form a vertically integrated model with strong growth potential.

Amid the rapidly expanding demand from electric vehicles, high-power electronics, and renewable energy applications, Latent Technologies will continue advancing SiC innovation and collaborating with industry partners to drive next-generation semiconductor technologies.

Substrate
Supplies silicon carbide (SiC) substrates for third‑gen semiconductors. Includes semi‑insulating wafers for RF/microwave and conductive wafers for power electronics in EVs, renewables, and grids, available in 4", 6", and 8" sizes.... More Info Less Info



🔷Product Categories
The products are mainly divided into two categories:
1. High-Purity Semi-Insulating Substrates
These substrates feature extremely low conductivity and excellent high-frequency performance, making them suitable for microwave and RF device fabrication. End applications include:
• 5G communication base stations
• Radar systems
• Satellite communications
They effectively reduce signal loss and improve system stability in high-frequency, high-speed environments.
2. Conductive Substrates
These substrates provide good electrical conductivity and high voltage tolerance, primarily used in power electronic devices. Key applications include:
• Electric vehicles (e.g., traction systems, onboard chargers)
• Photovoltaic power systems
• Smart grids
• Rail transportation (e.g., high-speed rail)
They significantly enhance energy conversion efficiency and reduce power loss.
🔷Product Sizes
To meet various application needs and process developments, three mainstream sizes are available:
1. 4-inch Substrates
A mature, early-stage product mainly used for research and niche applications, still valuable for small-batch or specialized uses.
2. 6-inch Substrates
Currently the market mainstream, offering mature manufacturing technology, stable quality, and large-scale commercial supply.
3. 8-inch Substrates
Representing the latest industry trend, these substrates provide higher material utilization and lower manufacturing cost. With technological advancements and capacity expansion, 8-inch substrates are driving the industry toward greater efficiency and scalability.
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🔷 Product Advantages
• High-performance material properties: Suitable for high-frequency, high-voltage, and high-temperature environments
• Wide application range: Covers communications, energy, transportation, and more
• Continuous technological advancement: Aligns with the transition toward larger substrate sizes
• Supports green energy development: Improves energy efficiency and contributes to carbon reduction


Epiwafer

Epiwafer is designed for third-generation semiconductors, enabling high-efficiency power devices with high voltage tolerance, strong current handling, and excellent thermal reliability for new energy and industrial power systems.... More Info Less Info





🔷 Key Product Advantages

1. Silicon Carbide Homoepitaxy Technology
Through precise epitaxial growth on high-quality SiC substrates, an epitaxial layer with controlled thickness and doping concentration is formed. This process effectively reduces the impact of substrate defects, significantly improving device breakdown voltage and switching performance—an essential foundation for high-voltage and high-frequency power devices.

2. Multi-Size Wafer Supply Capability
The product portfolio covers mainstream wafer sizes, including 3-inch, 4-inch, 6-inch, and advanced 8-inch epitaxial wafers. It supports diverse process platforms and manufacturing requirements. Mass production of 8-inch wafers has been achieved, enabling scalability and cost optimization.

3. High Uniformity and Stability
Advanced process control and rigorous quality management systems ensure excellent uniformity and consistency across batches, supporting high-yield and reliable wafer fabrication processes.

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🔷 Applications

Widely applied across fast-growing industries, including:

• Electric vehicle (EV) power control systems
• EV charging infrastructure
• Photovoltaic inverters and energy storage systems
• Railway traction systems
• Smart grids and power conversion equipment
• Industrial high-efficiency power supplies

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🔷 Quality & Certification

Manufactured under strict quality control systems and compliant with international automotive and industrial standards (such as IATF 16949), the product meets demanding requirements for reliability and long-term performance. It is widely adopted by leading global power semiconductor companies.



Advanced Wet Processing & Wafer Handling Equipment

These products serve semiconductors and advanced materials, offering efficient, reliable wet processing and wafer surface treatment solutions. Widely used in ICs, SiC/GaN, LEDs, and photovoltaic applications... More Info Less Info





1. Wet Processing Equipment

Designed for critical processes such as wafer cleaning and etching, these systems deliver precision and consistency:

• Fully Automatic / Semi-Automatic Batch Cleaning Systems
  Equipped with advanced automation control for batch wafer processing, featuring precise temperature control and chemical circulation filtration to ensure process stability and contamination control.
• Single-Wafer Wet Processing Equipment
  Includes automatic wafer stripping systems, scrubbing systems, and final cleaning equipment for SiC epitaxial wafers. These systems enable efficient, non-destructive cleaning of fine wafer structures, meeting advanced process requirements.

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2. Wafer Auxiliary & Front-End Equipment

• Fully Automatic Wafer Edge Grinding / Profiling System
  Designed for precision edge processing to eliminate chipping and micro-cracks, improving wafer strength and overall yield.
• Fully Automatic Wafer Scrubbing System
  Effectively removes particles, residues, and organic contaminants from wafer surfaces, ensuring high cleanliness for subsequent processes.

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3. Wafer Drying Equipment

• Marangoni Drying System / Horizontal Spin Dryer
  Utilizing Marangoni surface tension principles or high-speed centrifugal technology, these systems achieve rapid and efficient drying, preventing watermark residues, particle contamination, and electrostatic defects.

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4. Chemical Supply System

Provides automated solutions for high-purity chemical preparation, delivery, and distribution:

• Ensures stable and precise chemical concentration control
• Improves process consistency and operational safety
• Reduces manual handling risks and environmental impact

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This integrated product lineup supports semiconductor manufacturing processes from cleaning and surface treatment to drying and chemical management, helping enhance yield and operational efficiency.



Inspection Equipment

Advanced semiconductor inspection and metrology systems use high-speed optics and AI to detect micro defects and measure wafer geometry, thickness, and flatness, improving yield, ensuring quality, and boosting production efficiency... More Info Less Info





🔷Wafer Defect Inspection (Defect Detection)

These systems leverage high-speed imaging and AI algorithms to detect microscopic defects that impact yield and device performance.

• SiC Wafer Inspection Systems
  • Designed for silicon carbide (SiC) materials
  • Detects contamination, micro-scratches, and cracks
  • Optimized for third-generation semiconductor processes
• Patterned Wafer Inspection (AOI)
  • Inspects wafers with circuit patterns
  • Identifies scratches, pits, and particle contamination
  • Provides automated defect classification and localization
• Surface Inspection Systems
  • Uses bright-field and dark-field imaging
  • Compact and suitable for R&D or fast inspection
  • Enables high-resolution analysis of surface defects

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🔷Geometry and Thickness Metrology (Dimensional Measurement)

These tools ensure wafers meet strict nanoscale manufacturing standards.

• Wafer Geometry Measurement
  • Measures warp, bow, thickness, and TTV
  • Supports precise surface profiling and process control
• Multi-Layer Thickness Measurement
  • Analyzes complex film stacks
  • Supports warped wafers and various materials
  • Ensures accuracy in deposition processes
• Precision Instruments
  • Edge contour profilers
  • Thin-film measurement tools
  • Nano-structure metrology systems

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🔷Packaging and Custom Inspection Solutions

Designed for back-end semiconductor processes and specialized applications.

• Packaging Process Inspection
  • Alignment verification during cutting and bonding
  • Post-processing quality checks
  • Device marking and identification inspection
• Multi-Axis Flatness Systems
  • Customized for advanced materials
  • High-precision multi-directional surface measurement

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🔷Technology Foundation

• High-speed optical imaging
• AI-based defect recognition
• Advanced data processing
• Nanoscale measurement precision

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🔷Value and Applications

Applicable to Si, SiC, and GaAs wafer manufacturing, as well as packaging and optoelectronics.

Key benefits:

• Improved yield and process control
• Early defect detection
• Reduced material waste
• Enhanced manufacturing reliability

These solutions act as critical quality control tools across the semiconductor production lifecycle