Fine Ceramic Materials for Advanced Packaging.
Overview
•Founded in 2016, Max Luck Technology Inc. (MLTi) specializes in advanced materials and related applications, including aluminum nitride heaters, silicon nitride substrates, alumina substrates, and diamond substrates.• Max Luck Technology Inc.（MLTi）成立於2016年，專注於先進材料及相關應用，包括氮化鋁加熱器、氮化矽基板、氧化鋁基板及鑽石基板。
•In 2020, MLTi developed a semiconductor CIP (Continuous Improvement Process) solution to improve yield, increase production capacity, extend equipment lifespan, and reduce downtime.• 2020年，MLTi開發了半導體CIP（持續改進流程）解決方案，以提升良率、提升產能、延長設備壽命並減少停機時間。
•In 2023, MLTi independently developed large-area diamond coatings for use as interposer thermal layers in 3D packaging, effectively enhancing heat dissipation and eliminating chip hotspots.• 2023年，MLTi獨立開發大面積鑽石塗層，用於3D封裝中的中介熱層，有效提升散熱效果並消除晶片熱點。
•In 2025, the company plans to produce large-diameter diamond wafer carriers, an ideal substrate for advanced semiconductor SoIC packaging.• 2025年，公司計劃生產大直徑鑽石晶圓載體，這是先進半導體SoIC封裝的理想基板。
•In 2026, MLTi introduced 12-inch transparent alumina ceramic substrates, also known as Crystal Wafer Carriers (CWC), for advanced packaging processes, providing an optical-grade solution for semiconductor packaging.• 2026年，MLTi推出12吋透明氧化鋁陶瓷基板，亦稱為晶圓載體（CWC），用於先進封裝工藝，提供半導體封裝的光學級解決方案。