Nippon Electric Glass Co., Ltd.

Otsu,  Shiga 
Japan
https://www.neg.co.jp/en/
  • Booth: X0031

  Products

  • 半導體支撐用玻璃載Glass Wafer for Supporting Semiconductors
    提供從低膨脹到高膨脹的高精度玻璃基板

    High-precision glass substrates available in a wide range, from low to high expansion...

    • 這些高精度玻璃載板基板用於在半導體封裝過程中支撐晶片及其他元件。

    我們提供從低熱膨脹到高熱膨脹的多種玻璃材料，並可根據客戶要求的熱膨脹係數（CTE）提供客製化玻璃解決方案。

    These high-precision carrier substrates support chips and other components in the semiconductor packaging process.

    We offer a wide range of glass, from low to high expansion, and can provide glass tailored to the requested coefficient of thermal expansion.

    特點

    • 提供從低膨脹到高膨脹的多樣化產品陣容
    • 可實現 TTV*1 ＜ 1 μm（Φ12 吋）
    • 支援 T7 Code

    *1 總厚度變異（Total Thickness Variation）

    Features

      ●Wide range of products from low to high expansion    ​●TTV*1 <1 μm is possible (Φ12 inch).    ●T7 code compatible
        *1 Total Thickness Variation

    Properties

    Glass code ABC-G A58 A66S A69 A75 A91S
    Coefficient of thermal expansion 20-220℃ ppm/℃ 3.6 5.6 6.3 6.6 7.2 8.7
    20-260℃ ppm/℃ 3.7 5.7 6.4 6.7 7.3 8.8
    Young’s modulus GPa 73 70 77 74 75 70
    Dielectric constant 1MHz, 25℃ 5.3 6.2 6.5 6.8 6.9 7.7
    tan δ 1MHz, 25℃ 0.001 0.02 0.01 0.01 0.01 <0.03
    Volume Resistivity Log ρ 150℃ Ω・cm ー 8.1 8.6 8.3 8 7.1
    250℃ Ω・cm ー ー 6.8 ー 6.2 ー
  • nanoWave™奈米紋理化技術｜Nano-texturing Technology
    玻璃表面奈米紋理化技術
    Glass Surface Nanotexturing Technolog...



    • ●提升銅附著力的奈米級粗化表面
    ●奈米紋理表面
    ●對傳輸損耗影響極低（60 GHz 時 ≤0.01 dB/cm）
    ●nanoscale-roughened Surface for Cu Adhesion
    ●Nano-textured Surface
    ●Negligible impact on Transmission Loss (≤0.01 dB/cm at 60 GHz)


    適用於先進半導體封裝的奈米錨定效應
    Nano-anchor effect for advanced semiconductor packaging

    01　高附著力

    High Adhesion


    透過奈米錨固效應提升銅附著力
    Enhanced Cu adhesion via nano-anchor effect

    02 低傳輸損耗

    Low Transmission Loss

    有效抑制高頻訊號傳輸損耗
    Minimized signal loss at high frequencies




    （經 nanoWave™ 處理玻璃的傳輸損耗）−（未處理玻璃的傳輸損耗）以共面傳輸線測試結構量測
    (Transmission loss of nanoWave™ treated glass) − (Transmission loss of untreated glass) Measured with coplanar line pattern

  • All-Solid-State Sodium (Na) Ion Secondary Battery
    全固態鈉離子二次電池 All-Solid-State Sodium (Na) Ion Secondary Battery...

    • 適用於半導體製造極端環境的全固態電池

    Extreme-Environment Battery for Semiconductor Manufacturing

    ●可於超過 200℃ 的高溫環境下運作
    ●可於高真空環境下穩定運行
    ●全固態結構，具備優異安全性

    ●Reliable operation even above 200℃
    ●Vacuum compatible design
    ●Superior Safety with an All-Solid-State Structure

  • 玻璃核心基板 Glass Core Substrate
    專為高效能半導體封裝打造的無機核心基板
    Inorganic core substrate engineered for high-performance semiconductor packaging...

    • 玻璃核心基板 Glass Core Substrate


    適用於半導體封裝的玻璃核心基板,專為微間距TGV加工而設計＆專為CO₂雷射TGV加工而設計
    Glass core substrate for semiconductor packages,designed for fine-pitch TGVs＆designed for CO₂ laser TGV processing

    相較於玻璃纖維環氧樹脂等有機材料基板，此核心基板具備更優異的平坦度、表面平滑性與剛性，因此更適用於大尺寸化應用。
    我們提供適用於雷射改質與蝕刻製程以及 CO₂ 雷射加工的材料與基板。
    自 2020 年起，我們持續投入玻璃材料開發與樣品供應，並成功開發出適用於雷射改質與蝕刻製程的新型材料。

    Compared to organic material-based substrates like glass epoxy substrates, this core substrate offers superior flatness, smoothness, and rigidity, making it well-suited for larger sizes.
    We offer materials and substrates suitable for TGV processing using laser modification and etching and CO₂ lasers. Since 2020, we have been engaged in the development of glass materials and the provision of samples, and have successfully developed new materials optimized for laser modification and etching.
    We are now able to provide large-size samples (515 × 510 mm) of glass core substrates with TGV processing.

    雷射改質 & 蝕刻　Laser modification & Etching

    ● 可對應多種CTE（熱膨脹係數）
    ●微間距、高深寬比TGV（玻璃通孔）
    ●Compatible with various CTEs (Coefficients of Thermal Expansion)
    ●Fine-pitch, high-aspect-ratio TGVs (Through-Glass Vias)

    CO₂雷射　CO2 Laser

    ●可與現有設備相容
    ●同時兼顧平坦度與通孔加工性
    ●Compatible with existing equipment
    ●Achieving both flatness and hole machinability

    GC Core™玻璃陶瓷基板 Glass-Ceramic Core Substrate

    適用於半導體封裝的 GC Core™ 基板，由玻璃與陶瓷粉末複合材料製成
    GC Core™ substrate for semiconductor packages made from a composite of glass and ceramic powders


    特點

    ・低介電常數、高熱膨脹係數，以及優異的機械強度
    ・可依不同應用需求進行客製化設計

    Features

    ・Low dielectric constant, high expansion, and exceptional strength
    ・Customizable to meet specific application requirements

    CO₂雷射  CO2 Laser

  • 微稜鏡 Micro Prism
    應用於光通訊、醫療及感測領域的微型玻璃稜鏡
    Micro Glass Prisms for Optical Communication, Medical, and Sensing Applications...

    • ●適用於光通訊與感測應用
    ●最小尺寸可達0.2 mm
    ●提供鍍膜選項
    ●Optical communication and Sensing
    ●Available in sizes (min 0.2mm)
    ●Coating options available
     

    產品形態變化 Shape Variations


    微小尺寸 Micro Size



    功能性塗層選項 Functional Coating Variations

    * Optical film is compatible with a wide range of wavelengths from ultraviolet to near-infrared.
     

    • AR coating
    • HR coating (dielectric multilayer film, Al, Ag)
    • TAP coating
    • PBS coating
    • Light-shielding coating
    • Metallized film, Solder film


    多種附加功能 Various Additional Functions

  • 微透鏡 Micro Lens
    應用於光通訊及其他領域的微透鏡陣列
    Micro Lens Arrays for Optical Communication and Others...

    • ●透過精密玻璃模造成型實現高尺寸精度
    ●支援多通道（~40ch以上）
    ●可依客戶需求進行客製化
    ●High dimensional accuracy by precision glass molding
    ●Supports multi-channel (~40ch and more)
    ●Customizable to meet customer requirement

    規格範例Specification Examples

    Material XC-1 (our original optical glass)
    Refractive index (nd) 1.81
    Shape Plano-convex array type
    Radius of curvature RO. 165mm
    Thickness ≤0.450 mm approx.
    Lens convexity ≤0.040 mm approx.
    Pitch 0.25 mm, 0.50 mm, etc.

    我們將根據您的需求，提供最適化的設計方案。We will create the optimal design based on your specific needs.

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