Automate your way to Pentamaster!
Overview
Headquartered in Penang, Pentamaster Corporation Berhad (The Group) is a global leader in providing advanced automation and manufacturing solutions. The Group provides a comprehensive suite of advanced packaging inspection and test solutions designed for the modern semiconductor landscape. Our technology supports high demands in SiC, GaN, and AI applications through a versatile range of capabilities.
Our technology roadmap is strategically aligned with the surge in Artificial Intelligence (AI), High-Performance Computing (HPC), and 5G/6G infrastructure.
The Group’s technology solutions address the critical needs of heterogeneous integration by offering:
•2D + 3D Wafer Inspection: delivering high-resolution 2D and 3D inspection, along with precise metrology.
•Silicon Photonics Probing & Test: Precision alignment and testing for optical communication components.
•Die-Level & Chiplet Prober: Validating individual components for heterogeneous integration.
•Substrate and Panel Level Testing: Electrical characterization and testing for complex substrates.
•X-ray 3D Inspection: Non-destructive 3D imaging for evaluating internal structural quality.
•Active Thermal Control System-Level Testing: Providing active thermal control at system level.
•HPC Burn-in: High-performance computing stress testing to ensure long-term reliability and durability.
Headquartered in the semiconductor hub of Penang, Malaysia, Pentamaster supports a global network of advanced semiconductor manufacturers across the United States, Europe, Africa, Asia Pacific & ASEAN countries. With advanced production facilities in Malaysia and China, and strategic support offices worldwide, we ensure our customers can scale their advanced packaging operations through localized technical expertise and reliable field support.