PROTEC CO., LTD.

Gyeonggi-do,  Korea (South)
http://www.protec21.co.kr/
  • Booth: N0388

Categories

200 Equipment, Assembly
  • Ball Placement; Attach Systems
  • Base Loader Systems
  • Device Handling; Feeding Systems
  • Dicing; Sawing; Scribing; Separation Equipment
  • Die Bonding; Attach Equipment
  • Die Removal Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Dispensing Systems
  • Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
  • Marking; Imprinting; Labeling Equipment
  • Package Handling; Conveying Equipment
  • Plating; Electro Chemical Plating for device assembly
  • Printing Equipment; Screen-printing; Alignment ; Film Printing
  • Solder Reflow; Soldering & Brazing Equipment
  • Tape Automated Bonding (TAB); Bumped Tape Automated Bonding (BTAB) Equipment
  • Wafer Mount; Taping Equipment
    • 202 Equipment, General Use
  • Cutting; Drilling; Laser ablation; Beveling Equipment
  • Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating
  • Welding Equipment

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