QUICK SEMICONDUCTOR

QUICK has developed the Neurapack Series, a line of advanced packaging Thermal Compression Bonding (TCB) equipment designed specifically for core AI chip processes. It is ideal for cutting-edge applications including HBM stacking, CoWoS packaging, and CPO (Co-Packaged Optics).

The system has overcome key technical hurdles—including high-precision alignment, accurate temperature control, precise force control, and fluxless plasma bonding. It addresses critical industry challenges such as fine-pitch bump interconnects, large-die warp control, and damage-free handling of ultra-thin dies.

As packaging technologies for automotive and consumer electronics signal-processing chips continue to evolve, the High-Speed Eutectic Die Bonder developed by QUICK stays at the forefront of global industry trends, perfectly matching next-generation packaging requirements.

Supporting eutectic bonding processes, the equipment achieves an impressive UPH (Units Per Hour) of up to 21K, delivering world-class performance. It has been successfully deployed and mass-shipped to multiple leading global semiconductor manufacturers.

Prior to sintering, dried silver paste and silver film both lack surface tackiness, presenting a technical challenge when mounting SiC dies directly onto AMB substrates. To bridge this gap, heat and pressure are applied simultaneously during mounting—a specialized process known as thermo-compression pre-bonding.

Engineerd for this precise requirement, Quick Semiconductor’s Pre-Sintering Thermo-Compression Die Bonder is fully compatible with both silver paste and silver film processes. Built with an anti-oxidation design in the bonding zone to minimize product oxidation risks, this versatile system handles multi-material placement seamlessly, including SiC dies, DTS, Clips, and NTC components.

Featuring a 6-nozzle module design, the system delivers placement accuracy of ±25μm with a throughput exceeding 6K UPH, and supports large-format carrier sizes up to 330×660mm. It seamlessly accommodates multiple feeding methods, including Wafer (up to 12-inch), Tray (4-inch), and Tape/SMT feeder. Integrated with automatic preform solder cutting and placement, as well as automated nozzle and ejector pin changing, the equipment enables multi-wafer and multi-die bonding. It provides a highly versatile, all-in-one solution for solder paste bonding, perform solder bonding, die sorting, and substrate layout/mounting.

QUICK’s Optical Module Die Bonder is specifically engineered for optical COB and BOX packaging applications. It comprehensively supports precise multi-material placement across both TX and RX functional assemblies.

The equipment achieves placement accuracies of ±1.5μm for glass dies and ±3μm for production dies, utilizing epoxy dipping and dispensing bonding processes. Built with an independent dual-station parallel architecture, it enables simultaneous dipping and bonding to eliminate waiting times and maximize UPH. Featuring wide-range precise force control (10–2000g), seamless switching between 6×6" and 4×8" blue tape, and a compact footprint design, it provides an exceptionally flexible, space-efficient packaging solution.

Dedicated to high-speed optical module packaging, QUICK’s Optical Module Eutectic Die Bonder supports COC, COS, and Flip Chip applications tailored for 400G, 800G, and 1.6T optical transceivers.

Delivering high placement precision of ±3μm, the machine utilizes advanced eutectic bonding technology. It features a dual eutectic stage architecture—with each stage integrating 8 buffer stations—enabling sequential mounting of up to 8 distinct materials for superior flexibility. Driven by a 3-bond-head collaborative system running loading, eutectic bonding, and unloading in parallel, paired with a rail-based automated handling system and an integrated screw-tightening assembly module, it guarantees ultra-high throughput and streamlined production workflows.