Rehm Thermal Systems (Hong Kong) Limited

With the VisionXP+VAC. we offer innovative solutions for reflow soldering. In just one process, a vacuum module enables convection soldering processes to be carried out with a vacuum. This reliably removes pores, gas occlusions and voids immediately after the soldering process whilst the solder is still in its optimal molten state. Complex processing of the assembly via an external vacuum system is no longer necessary and the workpieces are moved straight into the vacuum process from the peak zones.

The Condenso series of vapor-phase soldering systems can be customized to suit different production environment, perfectly meeting all application requirements. From compact designs to high-throughput in-line configurations, we offer high-performance vapor phase reflow systems. Leveraging a patented gas injection principle, these systems enable simultaneous control of both reflow temperature and pressure (vacuum), resulting in more precise and broader reflow profiles. They are particularly well-suited for automotive electronics, consumer electronics, semiconductors, aerospace, medical electronics, as well as various 5G, IGBT, and new energy vehicle products.

The Nexus vacuum contact soldering system is suitable for vacuum and flux-free soldering processes at temperatures up to 450°C. The system can utilize a variety of process gases, chemical activators, and formic acid, and supports both lead-free and leaded soldering. The Nexus is primarily used in the manufacturing of advanced packaging and power electronics products. Optional vacuum features help minimize oxidation of components and joints and effectively reduce voids in the joints.