High-yield bonders & sorters for advanced packaging.
Overview
Saultech specializes in core Pick & Place technologies, providing precision Die Bonder and Sorter solutions for advanced packaging (e.g., CoWoS, 3D IC, Hybrid Bonding). We are dedicated to solving a long-standing industry challenge: achieving extreme alignment accuracy without compromising the throughput required for high-volume manufacturing (HVM).
At SEMICON Taiwan, Saultech will showcase breakthroughs in high-end domestic automation, helping foundries and OSAT clients establish localized packaging lines with a superior Total Cost of Ownership (CoO).
Core Technologies & Showcase Highlights:
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Breakthrough in Precision & Throughput: The DB-22HP (Hybrid Bonding specialized) features a high-rigidity granite dual-gantry base. It achieves a stable output of 1.5K UPH while maintaining an ultra-high alignment accuracy of <±0.2μm, breaking the throughput bottleneck typical of high-precision equipment.
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Zero-Defect Yield Control: To address critical particle and bubble issues in advanced processes, we have introduced our patented "Bond Wave" process and active vibration isolation. Combined with laminar flow design, we eliminate void risks at the bonding interface from a physical level.
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Ultra-Thin Die Handling: In response to HBM and multi-stacking trends, we offer mature, high-speed, non-destructive peeling technology for dies as thin as 25μm.
With a strong R&D engine, Saultech rapidly adapts to the challenges of specialized processes. We cordially invite industry professionals to visit the Saultech booth for Live Demos of our high-end die-bonding equipment and to explore scalable solutions for heterogeneous integration.