Shenyang Heyan Technology Co.,Ltd

Founded in 2011, SHENYANG HE YAN TECHNOLOGY CO., LTD established Suzhou Heyan Precision Technology in 2021. In 2024, we launched a Joint R&D Center with Dalian University of Technology and an R&D lab in Japan. In 2025, we completed a strategic integration with Yunzhe Semiconductor.Solutions provided for grinding, cutting, lamination, peeling, cleaning, and diagnostics.

With 800+ employees and domestic sales centers across major cities, our products are exported to South Korea, Malaysia, Singapore, Thailand, and Vietnam. We specialize in precision grinding and dicing for hard/brittle materials (silicon, glass, ceramics, GaAs, LiNbO3, SiC), providing integrated semiconductor equipment and process solutions.

Core Equipment:

DS Series Dicing Saw: For advanced/traditional packaging, supporting full/half cuts, V-groove, and edge trimming.

HG Series Wafer Grinder: Integrates ultra-precision grinding, dry polishing, and tape removal for fully automated inline processing.

JS Series Auto Cutting & Sorting Machine (JIGSAW): Includes JIG/BULK/PANEL SAWs. Cutting, sorting, and fixtures are independently developed.

RMT Series Re-Mounter: Features the world's first advanced packaging re-mounter capable of two cycles per single loading, with high warp resistance and low consumable use.

Industry Position:

We are a National-Level "Little Giant" Enterprise and Liaoning Manufacturing Single Champion. In 2025, our wafer dicing saws ranked 2nd globally. We have led industry sales for 15 years, shipping over 1,500 units annually and holding >70% of China's domestic market share.

Technical Heritage:

With 15 years of expertise, our team stems from the original national precision dicing saw project group. Core members average 20+ years of experience. Backed by Shenyang and Suzhou R&D centers, we hold 120 invention patents, 68 utility model patents, and 5 design patents.

Why Choose Heyan?

Tech Leadership: World-class core technologies with proprietary control software, top-tier image recognition, and drill bit tech (NCS, BBD).

Reliable Quality: Rigorously tested equipment running stably on 900+ global customer lines.

Rapid Response: Comprehensive network offering 24/7 technical support.

Customization: Tailored process solutions, including custom software upgrades, worktables, and auxiliary equipment.

DS9262(Precision Dicing Saw )

The DS9262 machine is fully compatible with OHT and AGV systems. It can also integrate modules such as CO₂ foamers and cutting fluid injectors to enable intelligent linkage between built-in auxiliary units and the mainframe.... More Info Less Info







The DS9262 machine is fully compatible with OHT and AGV systems. It can also integrate modules such as CO₂ foamers and cutting fluid injectors to enable intelligent linkage between built-in auxiliary units and the mainframe.

Equipped with CCS, LSD and high-cleanliness modules to meet demands of diverse application scenarios.

Fitted with a high-performance spindle system. Optimizations on spindle material, mechanical structure and motion control system enhance precision stability during long-term continuous operation.

Newly upgraded software architecture greatly boosts system stability and compatibility. A revamped UI interface and streamlined operation logic deliver smoother human-machine interaction and safer operation.



RMT Series Automatic Film Remover

It is the world’s first equipment capable of two film removal cycles on a single machine, combining two repetitive processes into one step and completely eliminating breakage risks during ultra-thin wafer transfer.
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It is the world’s first equipment capable of two film removal cycles on a single machine, combining two repetitive processes into one step and completely eliminating breakage risks during ultra-thin wafer transfer.

A universal dedicated wafer positioning module supports multiple positioning modes including V-notch, center and contour positioning, offering broad adaptability to various wafer types.

Its independent partition design allows selection of single or secondary film removal to accommodate double-sided processes or single-sided film replacement.

It is equipped with a high-quality film laminating mechanism and a high-safety cutting module for tape slitting. Bare wafer transfer inside the machine is eliminated, effectively removing handling risks.

A unique wrinkle-proof laminating design ensures uniform, high-quality film attachment even for ultra-thin and highly warped wafers.



LRC Series Automatic Laser Ring Cutting Machine

The LRC series features two wafer pickup platforms that perfectly match the tact time of laser ring cutting, improving overall cutting efficiency.
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The LRC series features two wafer pickup platforms that perfectly match the tact time of laser ring cutting, improving overall cutting efficiency.

Both the ring cutting and pickup stations adopt backside wafer suction, effectively preventing secondary wafer contamination by residues generated from laser ablation. A built-in dust removal system delivers superior performance for clean wafer manufacturing.

Outfitted with high-precision motion stages and adjustable pulse width lasers, it accommodates wafers of different materials and thicknesses for a wide range of products.

Customizable film-free ring cutting is available, and the machine can be inline-connected with tapers to further cut manual operations and hazards while elevating production automation.



HG5360（GRINDER）

The HG5360 is an integrated automatic wafer grinding, polishing and film laminating machine for backside grinding, stress relief, film lamination and film peeling.
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The HG5360 is an integrated automatic wafer grinding, polishing and film laminating machine for backside grinding, stress relief, film lamination and film peeling.

Compatible with 8-inch and 12-inch wafers, it stably completes full thinning processes down to 50 μm.

Fully automated workflow covering loading, positioning, rough grinding, fine grinding, polishing, cleaning and unloading delivers high productivity, superior machining accuracy and minimal wafer damage.

Force variation data collected during polishing enables dynamic polishing force adjustment for improved surface finishing.

A two-fluid curtain cleaning system thoroughly cleans ground wafers with minimal substrate damage.

A standalone cleaning module cleans wafer front sides to reduce breakage risks for ultra-thin wafers.

The film laminating unit supports both pre-cut and batch-cut formats.

An optimized high-efficiency wafer transport path reduces the number of handling trays and lowers cracking risks for thin wafers.



JS2802(JIG SAW)

The JS2802 is mainly deployed for automated precision dicing, inspection and sorting of mainstream IC packages including QFN, DFN, BGA and LGA. It drastically shortens process steps and raises productivity and automation levels.
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The JS2802 is mainly deployed for automated precision dicing, inspection and sorting of mainstream IC packages including QFN, DFN, BGA and LGA. It drastically shortens process steps and raises productivity and automation levels.

The equipment integrates multiple self-developed core technologies: high-precision film-free dicing, high-speed visual inspection, high-speed high-precision die handling, and high-stiffness vacuum systems.

High-speed visual inspection paired with high-speed precision die handling enables visual quality verification, sorting and precise placement of dies.



WM-3000V (Fully Automatic Vacuum Laminator)

The WM-3000V series is a fully automatic 8 & 12-inch wafer backside dicing tape laminator specifically designed for the semiconductor industry. To meet diverse customer requirements, it offers flexible automated loading options... More Info Less Info







The WM-3000V series is a fully automatic 8 & 12-inch wafer backside dicing tape laminator specifically designed for the semiconductor industry. To meet diverse customer requirements, it offers flexible automated loading options: Open Cassettes (OCS) or wafer carriers ('cake boxes') for 8-inch wafers, and FOUPs, FOSBs, or cake boxes for 12-inch wafers.

Load Port Unit

Flexible Loading: Supports Open Cassettes & Carriers for 8-inch; Carriers, FOUPs & FOSBs for 12-inch.

Smart Detection: Cassette misalignment detection & automatic anti-static paper recognition.

Safety Protection: Cassette secure-clamping mechanism & comprehensive scanning protection (prevents tilted insertion

Wafer Transfer Robot

1. Fully automatic vacuum robotic transfer system.
2. Supports 4-axis configuration with a repeatability of ±100 μm. High-speed operation significantly boosts UPH (Units Per Hour).
3. Robotic arms can be customized according to specific customer requirements.