RECIF Technologies S.A.S

376 Business Park
7 Nancy Court, Suite 6
Wappingers Falls,  NY  12590

United States
  • Booth: 2028

RECIF Technologies, a world leading equipment supplier supporting the leading edge wafer handling and tracking solutions, remains the premier innovator and benchmark in wafer sorting. First incorporated in 1982, RECIF’s latest tool development of the G5+ and EFEM’s are just two newer products in a long line of successful tool models reaching back to the first sorter introduced to the semiconductor manufacturing in the early 1990’s. Thousands of tools in the interim, RECIF is still acknowledged as the world leader in high added value robotics and handling solutions for the Semi Conductor Industry.

We support the wafer manufacturing at the most advanced nodes (towards the 7 nanometer), as well as "More than Moore" wafer applications.

Our commitment is to support our customers with high quality and innovative equipment, to answer their productivity requirements as well as their manufacturing process continuous improvement, meeting the highest industry standards and customers’ expectations related to reliability, cleanliness, wafer-level automation, safety and cost of ownership.

 Press Releases

  • RECIF Technologies delivered its first G5+ wafer sorter prototype.

    This installation in the clean room of the imec (Interuniversity Micro Electronics Centre) based in Leuven (Belgium), took place in the frame of a European collaborative project, aiming at demonstrating the integration of 7nm IC technology, using the imec pilot line.

    The contribution of RECIF within the project is to support the advanced patterning, with state of the art wafer sorter platform prototype, and demonstrate its leading edge cleanliness in terms of particles and metal contamination.

    Thanks to this project, RECIF will prove its compliance with the industrial expectations, required for the manufacturing of the most advanced nodes (7nm and beyond).

    Leading edge cleanliness will provide IC manufacturers with a clear advantage in terms of yield management, and make of RECIF the partner of choice for their manufacturing.

    For more information, please contact your regular RECIF representative or send a mail to

  • RECIF Technologies designs, manufactures, distributes and maintains robotic handling equipment for the semiconductor industry.

    PEER Group® provides innovative factory automation software solutions and consulting services to the semiconductor, photovoltaic, and electronics industries. The world’s best manufacturing companies turn to PEER Group to solve their most challenging equipment automation, data management, and process control problems.

    RECIF Technologies and PEER Group recently completed co-development of a RECIF EFEM software component to add built-in support of the RECIF EFEM to the PEER® Tool Orchestrator (PTO™) plug-and-play library of industry-standard components. This enables RECIF robotics to be driven by PTO.

    PEER Group and their PTO product now support RECIF’s 450/300 EFEM out-of-the-box. OEMs automating their equipment via PTO can connect the RECIF 450/300 EFEM solution and modules to their equipment easily.

    This achievement will provide both companies with multiple opportunities to enhance their level of product offerings and will enable more collaboration with customers.

    “RECIF sees the integration with PEER Tool Orchestrator as a key and very positive achievement. With respect to the release of our new EFEM 450/300 platform, it was a must for RECIF to be compatible with the most popular tool automation software platform worldwide!” Alain Jarre Chairman CEO

    “PTO’s extensive and evolving list of plug-and-play hardware automation components enables OEMs to select and change out tool hardware components easily. Adding the RECIF EFEM hardware to our library of industry-standard components provides additional design flexibility for our users.” Bill Schmalz Director, Global OEM Sales of PEER Group

    For more information, please contact your regular RECIF representative or send an email to


  • G5+ 300mm wafer sorter
    G5+, new RECIF 300mm sorter takes benefit from newer technologies and modules integrated and tested throughout 2012 – 2015. It aims at setting a new benchmark for the next decade....

  • G5+resultsfromdesignconsiderationstakingintoaccounttherequirementsdrivenbytheneedfor: Morerobustness Bestinclasscleanliness ImprovedarchitectureG5+mainfeatures: Vacuumfreebacksidecontactoredgecontactendeffector Ontheflywaferalignment Newindustrialcontroller Newrealtimefieldbusandelectronics Singlewaferflipperorsinglewaferbufferindedicatedcasingoption 4LPinlinecanbeintegratedintostocker N2purgecapabilityonloadports EasyrecipecreatorsoftwareFurtherinformationavailableuponrequest
  • Manual Vacuum Wafer Handling (VHS)
    RECIF manufactures a complete range of Vacuum Handling Systems. The use of clean organic materials, patented vacuum tip design & true ESD protection provides a unique system with the highest levels of cleanliness & safety.......

  • RECIF Technologies history started in 1982 offering its first wafer handling solution: Vacuum Handling Systems.
    Based on this historical technical mastery, RECIF Technologies provides today a full range of single wafer manual vacuum handling solutions adapted to our customers’ and current Semiconductor industry’s’ requirements.


    • Our patented vacuum tip design
    • The use of clean organic material
    • A true ESD protection

    Our Vacuum Handling Systems VHS range offers:

    • The highest level of cleanliness and safety
    • Total liberty of configuration to meet your specific needs and requirements
    • Manual single wafer handling from 100mm to 450mm

    All parts of our Vacuum Handling System are interchangeable. They can be configured or upgraded to meet specific end-user requirements.

    • Angled versions of tips available (10°, 30°)
    • Optional ergonomic upgraded wand - designed for 450mm wafers but also applicable for 300mm
    • Straight or coiled tubes
    • ...
  • EFEM platform
    Our new robotics platform is offered as EFEM solutions for various substrate sizes and types (3D IC, advanced packaging)...

  • Smart EFEM platform

    • Single or dual handler; Single or dual aligner
    • Extended reach (info available upon request)
    • Flexible integrations scenarios
    • New SW platform compatible with main controllers (PEER Group, AIS, Agileo)
    • Flexible and robust robotics based on 450mm design demonstrated at imec
    • Robotics compatible with 300mm, 450mm, dicing frames

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