MRSI Systems

101 Billerica Ave
Building #3
North Billerica,  MA  01862

United States
  • Booth: 5169

MRSI Systems Die Bonding and Epoxy Dispense Systems.

MRSI Systems is recognized as the standard of the industry, delivering solutions for high precision dispense and assembly to the semiconductor and microelectronics industry. We offer systems for the manufacture of Photonic, Sensor,  Microwave, MCM’s and MEM’s devices. We enable customers to optimize the performance of their process including yield, throughput and uptime. With three decades of advanced packaging application experience, MRSI Systems' products support multiple interconnect technologies, including eutectic attach, epoxy die bonding, thermo-compression and flip chip. The ultra-precision MRSI-M3 with 3 micron capability (1 micron option available) and the MRSI-705 Die Bonder with 5 micron capability specialize in thin die handling and 3D packaging and the MRSI Systems MRSI-175Ag Epoxy Dispenser is the leader for high precision conductive epoxy dispensing including 125 micron dots. Supported dispense technologies include auger style pumps, precision time/ pressure, stamping and jetting.

 Press Releases

  • North Billerica, MA, USA, March 20, 2017 — MRSI Systems, a leading provider of fully automated, high-speed, high-precision die bonding and epoxy dispensing systems, today announces the installation of its flagship MRSI-M3 Die Bonder in AIM Photonics Academy’s Education and Practice Factory at the Massachusetts Institute of Technology (MIT) in Cambridge, MA, USA. This is the beginning of a great relationship that will lead to further collaboration in research and education of integrated photonics.

    American Institute of Manufacturing (AIM) Photonics Academy built the Education and Practice Factory at MIT to enhance its education and training programs in integrated photonics manufacturing for the next generation of engineers. AIM Academy chose MRSI Systems as a partner because of its 33 years of experience as a leading solution supplier in this industry, its strategic vision, and its fast, accurate, and flexible systems that research and high-volume manufacturing of integrated photonics require. The MRSI-M3 will be an integral part of the Factory’s education and training program in chip packaging, board integration and assembly, and inspection and testing.

    “MRSI Systems has been serving optoelectronics and microelectronics customers for the past thirty-three years. We are very pleased to partner with the AIM Photonics Academy’s Education and Practice Factory at AIM Academy, which has created a unique environment for engineering students and researchers to learn automation and to develop advanced prototypes at the same time,” said Mr. Michael Chalsen, President, MRSI Systems. “We appreciate the opportunity to contribute to its success and look forward to further collaboration with the Education and Practice Factory at MIT and with AIM Photonics.”

    “We chose MRSI Systems and the MRSI-M3 because we value MRSI’s state-of-the-art automation technology, strong process knowledge, and its products’ flexibility for research and volume manufacturing,” said Brian W. Anthony, PhD, Associate Director, AIM Photonics Academy. “MRSI Systems offered the best package for our requirements.  We look forward to further collaboration with MRSI Systems in training programs and prototype development.”

    About MRSI Systems

    MRSI Systems is a leading manufacturer of fully automated, high-speed, and high-precision die bonding and epoxy dispensing systems. We enable customers to optimize the performance of their process including yield, throughput and uptime by building systems that use our unique expertise. In summary, this includes, our proprietary software, proven hardware, deep process knowledge, state-of-the-art manufacturing and a world-class customer service team. MRSI’s systems are built on common platforms that can be configured to meet specific customer requirements. These platforms are designed to be scalable from prototype to volume manufacturing. Our solutions deliver the best financial returns in the industry, while integrating seamlessly into our customer’s production. Markets include Telecom/Datacom, Aerospace & Defense, Medical Devices, Computers and Peripherals, and Industrial. Since 1984, we have been recognized as the standard of the industry, delivering our solutions to leading optoelectronic and microelectronic customers worldwide. Our headquarters is located in Billerica, MA in the greater Boston area. Our sales are supported by a global network of direct service and support professionals, located in China, Taiwan, Singapore, Korea, Malaysia, the Philippines, Israel, the Netherlands, Switzerland, and the United States. For more information visit:

    MRSI Systems Media Contact

    +1 (978) 667-9449

    About AIM Photonics Academy

    American Institute for Manufacturing Integrated Photonics (AIM Photonics) Academy provides the unified knowledge, technology, and workforce interface for AIM Photonics, an industry driven public-private partnership that focuses the nation’s premiere capabilities and expertise to capture critical global manufacturing leadership in the photonics integrated circuit industry. The Institute’s goal is to emulate the dramatic successes experienced by the electronics industry over the past 40 years and transition key lessons, processes, and approaches to the photonic integrated circuit (PIC) industry. AIM Photonics supports Small and Medium Enterprises, providing practical access and technology on-ramps for U.S. industry, government, and academic communities. AIM photonics is creating a National PIC manufacturing infrastructure, widely accessible and inherently flexible to meet the challenges of the marketplace with practical, innovative solutions. For more information visit:

    AIM Photonics Academy Media Contact

    Brian W. Anthony +1 (617) 324 7437


  • MRSI-705 5-Micron Die Bonder
    The MRSI-705 5-Micron Die Bonder sets the mark for high-precision, high-speed component assembly....

  • The MRSI-705 5-Micron Die Bonder sets the mark for high-precision, high-speed component assembly. Engineered for manufacturing robustness, the MRSI-705 is a flexible configurable platform, with the largest installed base in the industry in advanced packaging. Applications are found across a wide range of market segments, such as life & health sciences, aerospace, defense, automotive, lighting, communications, and more.

    The MRSI-705 is built to meet the highest standards of reliability and dependability. It starts with an award-winning, industry standard platform with a day-in/day-out accuracy of 5 microns; achieved by leveraging the platform’s signature design features:

    • A solid granite platform supports the placement head from above, so that no mechanisms are cantilevered. All of this makes the MRSI-705 thermally and mechanically stable with extremely fast settling times and +/- 5 microns or better placement accuracy, a requirement for critical applications.
    • Minimized number of moving mechanical parts.
    • The major system X Y axes use zero force, ironless, actively cooled linear motors with high resolution linear encoders. Encoder scales have 0.1-micron resolution for fast, precise, closed-loop positioning. The linear motors deliver faster speeds (acceleration, deceleration and velocity), with better settling times and overall smoother motion.
    • Reliability is enhanced through the use of advanced air-bearing technology in the Z axis.


    The MRSI-705 produces the following compelling business outcomes for customers:

    • Strongest ROIs in the industry – A well-established platform with an unmatched Cost of Ownership. Lifts up overall production efficiency.
    • Extended Machine Lifetime –exceptional performance over time. Upgrade paths as new features are introduced.
    • Proven Manufacturing Readiness – A work horse with minimum downtime. Compelling reliability.
    • Configurable Asset – the MRSI-705 is an open platform that adapts to changing portfolios. Can handle complex multi-chip modules and other advanced assembly challenges with ease.
  • MRSI-175Ag Epoxy Dispenser
    The MRSI-175Ag Epoxy Dispenser handles the most demanding dispensing applications such as microwave modules, optical modules, hybrid circuits, multichip modules, and semiconductor packaging....

  • The MRSI-175Ag Epoxy Dispenser handles the most demanding dispensing applications such as microwave modules, optical modules, hybrid circuits, multichip modules, and semiconductor packaging. With the ability to operate two heads in tandem, the MRSI-175Ag provides unparalleled process control and comprehensive dispensing capability.

    Die attach, underfill, encapsulation and multi-pin stamping are all supported on this flexible dispensing platform.

    The MRSI-175Ag is a servo-controlled X, Y, and Z dispensing platform. The system’s two dispensing heads can be individually configured with various pump types, such as positive displacement, time/pressure and jetting.  A stamp head is also available with the capability to repeatedly stamp dots as small as 0.125mm. Dots of silver filled conductive epoxy of 0.25mm diameter are quickly and routinely dispensed by the system; a requirement frequently encountered for the assembly of microwave modules, as well as other advanced packages. Precise epoxy flow control is necessary to meet tight bond line thickness specifications, while achieving 100% area coverage.

    Driven by MRSI Systems’ Windows software, the MRSI-175Ag delivers a clean, easy to use interface, providing easy access to extensive process control functions, as well as to product programming capabilities.  The software is common to all MRSI Systems machines.


    As it with all other MRSI platform offerings, the MRSI-175Ag is built to last. Flexibility is built-in, with the ability to dispense two different materials, with different dispensing parameters, on any given application. Attention is given to automation, reducing operator intervention and machine downtime. Adding an MRSI-175Ag upstream from an MRSI-M3 3-Micron Die Bonder, MRSI-M1 or a MRSI-705, increases line efficiency and throughputs with a minimum investment.

    Advanced functionality equates to significant operational and financial benefits:

    • Increase capacity at lower cost  Separating the dispensing process step from the placement operation translates into lower costs by leveraging both machine types for what they do best.
    • Less Labor Cost – Automatic needle cleaning, automatic calibration routines mean less operator intervention and higher productivity.
    • Lower Cost of Ownership  Commonality with MRSI placement machines means lower spare parts cost, lower parts inventory, lower training costs.
    • Higher Yields High precision, automated process control functions, proven pump technology all come together to ensure maximum yields, which in turn translates into a lower cost per part.
    • Flexibility – Handle whatever comes your way with the ability to use the right pump for the right application. Reconfigure if needed.
  • MRSI-M3 3-Micron Die Bonder
    The MRSI-M3 3-Micron Die Bonder sets the industry standard for ultra-precision, high-complexity die attach in high volume production environments....

  • The MRSI-M3 3-Micron Die Bonder sets the industry standard for ultra-precision, high-complexity die attach in high volume production environments. With features such as force control, ultra precise placements, and 360° die orientation, the MRSI-M3 die bonder  ensures high yields, high quality and high reliability in advanced packaging.

    The highly configurable, MRSI-M3 platform ensures optimum asset protection. The system delivers an unmatched combination of 3-micron accuracy, automation, speed and reliability; in-situ assembly processes such as eutectic die bonding, UV epoxy die attach and flip chip assembly are all possible. The MRSI-M3 3-Micron die bonder is ideally suited for manufacturers of microwave modules, IR sensors, MEMS, multi-chip modules, stacked assemblies, hybrid devices and photonic packages.

    From small dies to large sensors, the MRSI-M3 3-micron die bonder provides all the capability and flexibility to assemble the most advanced packages, without compromising on manufacturing efficiency, quality and reliability.


    The MRSI-M3 uses an advanced cast composite base, enabling fast and accurate moves with virtually no settling time. The large work envelope enables a wide range of configurations (see options tab) to meet customer requirements.

    Advanced functionality equates to significant benefits:

    • High Speed AND High Accuracy – An advanced axis system driven by brushless DC linear servomotors with linear glass-scale encoder feedback for high speeds and accurate movements.
    • High Machine Efficiency AND High Product Quality – Built-in internal temperature monitoring ensures consistent placement. Known heat sources, such as motors are designed with gas cooling; ensuring that thermal expansion is kept to a minimum.
    • Optimum Placement Yields – The system’s closed-loop force control enables placement of delicate Gallium Arsenide (GaAs) dies with as little as 10 grams of force. At the other end of the scale, forces up to 2kg are programmable.
    • Flexible Component Supply Options – Die are picked from waffle pack, Gel-Pak™, wafer, tape and reel and custom trays.
    • Maximum Asset Use – MRSI-M3 machines are designed to handle a wide range of processes. Epoxy dispensing pumps, epoxy stamping and eutectic bonding with scrub and temperature control, are all configuration options that make the MRSI-M3 3-micron die bonder a complete assembly solution.

 Additional Info

New Exhibitor:
New Products:
Displaying Equipment:
Product Demonstrations:

Send Email

Type your information and click "Send Email" to send an email to this exhibitor. To return to the previous screen without saving, click "Reset".