SHENMAO Introduces New Ball Attach Flux SMF-WB51 for WLCSP/FOWLP
SHENMAO Technology, Inc. introduces New WLCSP/FOWLP Ball Attach Flux SMF-WB51 for excellent ball attach soldering due to its highly suitable wide reflow profile and designed for slump resistance to prevent bridging. Applicable for lead free and lead containing alloys, its higher viscosity, medium Ti index with stable slump characteristics present great printability and excellent stencil life, uniform dipping value in Flux Dip/Pin Transfer and Solder Ball Drop to create excellent Ball Hight and Coplanarity.
SHENMAO introduces New Generation Lead-free Solder Paste PF606-P140 and Zero-Halogen Lead-free Solder Paste PF606-P245 with a wide process window, superior print and solderability to solve Head on Pillow issues and improve ICT testability, easily fit into complicated PCB designs through excellent convergence performance.
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high-quality sphericity. Various diameters (0.76, 0.65, 0.64, 0.5, 0.45, 0.4, 0.3, 0.25, 0.2, 0.15, 0.1, 0.09, 0.08, 0.075, 0.07, 0.06, 0.055 and 0.05 mm Dia.- 0.045 and 0.040 mm Dia. are in development) are available in SAC305, SAC405 and SAC1205 Alloys at affordable low cost from 10 worldwide SHENMAO locations.
As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Cored Solder Wire and Flux, Solder Preforms, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Dipping Flux and PV Ribbon.
For more information, please contact:
SHENMAO America, Inc. www.shenmao.com Tel: 408-943-1755 e-mail: email@example.com