HWASHU Enterprise Co., Ltd.

11 Firestone
Irvine,  CA  92614

United States
  • Booth: 7323

Leading brand of the IC Tray, Tape & Reel, and Heat spreader

Found in 1982, Hwa Shu Enterprise Co. Ltd. specializes in precision mold fabrication and plastic injection molding. In the early days, it focused on the design and production of diverse consumer plastic injection molds and plastic products. After successful development of IC Tray and mass production in 1992, it has entered the packaging material supply chain of semiconductor packaging and testing industry and has expanded rapidly ever since, accompanied with the growth of Taiwan IC assembly/packaging and testing industry.

In 1998, we established the embossed carrier tape production line, and Tape & Reel has successively obtained the recognition from domestic and foreign major IC packaging and testing plants. In 2003, we successfully developed the production of chip tray again and set up a complete product portfolio of IC carrier package. 

Over 30 years, Hwa Shu has become one of leading providers of global IC Tray, Tape & Reel and Chip Tray and other products. The distribution of customers covers Taiwan, China, Japan, Korea, Singapore, Malaysia, Philippine and Thailand, and we have service offices in Singapore, Korea, and Japan.

 Press Releases

  • We have committed to become the leading brand of the IC Tray, Chip Tray, Tape & Reel, Heat spreader and other products in the global semiconductor packaging and testing industry. 

    We are currently the largest IC tray supplier in Taiwan and the Top 3 Tape and Reel supplier in Taiwanese semiconductor industry as well.

    Going forward, we are striving to achieve the ultimate goal of becoming NO.1 supplier for IC Tray, Tape&Reel, Chip Tray, and Heat Spreader globally in near future.

  • Our heat spreader prodcut line has 40% growth in terms of revenue in 2016, that to prove that we invest the maximum effort and resource into product design, validation, and engineering/sales support for all of our customers, and our effort and excellency in innovation and engineering was noticed and appeciated by all the major Design, IDM, and OSATs. 

    In 2017, following our tradition and motto, we are pouring more resource in the product develpoment (including facility expansion to fit for larger volume request and new automative production line integration) of heat spreader field and looking for further growth in terms of revenue as well as market share with all of our partners.  


  • IC/JEDEC Tray
    Tray type of IC Carrier for Assembly, Package, Testing, and SMT process. ...

    1. More than one thousand sets of IC tray molds to meet customers’demands for all kinds of package types and sizes.
    2. Complying with JEDEC standards, professional product deign provides customers’IC with best carrying and protection.
    3. Integrated mold manufacturing and production provide the fastest sample delivery and service for customers.
    4. Strict quality management provides the best product quality for customers.
    5. Maximum baking temperature : 180/150/135 ºC
    6. Surface resistivity : 1x105~1x1012 ohms/square
    7. Package types : BGA, TFBGA, FCBGA, QFN, QFP, LQFP, TQFP, TSOP, SOP, SIP and CIS
  • Tape and Reel
    Embossed Carrier Tape and Reel for IC or any semiconductor components in the application of testing, storage and out going package...

    1. More than 600 sets of Carrier Tape molds to meet customers’demands for all kinds of package types and sizes.
    2. The professional product design, complied with EIA standards, provides customers’IC with the best carrying and protection.
    3. Integrated mold manufacturing and production provides fast sample delivery schedule and services for customers.
    4. Strict material and production management provides the best product quality for customers.
    5. The product range covers semiconductor IC, WLCSP, Discrete, Optical devices, LED and other electronic components. The tape widths are mainly in 8,12, 16, 24, 32, 44, 56, 72mm, and with two (anti-static) materials, PS and PC.
    6. Types of Carrier tape: QFP, LQFP, TQFP, BGA, TFBGA, FCBGA, QFN, TSOP, SOP, SOT, TO, SIP, CIS and LED.
  • Heat Spreader
    Precise metal heat spreader products in the application of semiconductor assembly and packaging as well as small metal parts for LED and SIP packaging...

  • Metal Parts for LCD / LED

    Metal Parts for Hi-Tech Industry

    IC Heat Sink  for Semiconductor (DOFU, BGA, F/C, QFP, TFBGA, Sip, MEMS

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