Sikama International Partners with Air Products
Santa Barbara, CA - Sikama International Inc. and Air Products and Chemicals Inc. have partnered to introduce the Electron Attachment Fluxless Reflow System to the electronics wafer level packaging segment. This novel flux-free soldering technology uses activated hydrogen to remove metal oxides from electroplated solder bumps on semiconductor wafers and permit reflow of these bumps to obtain the proper shape and size for interconnection onto a package or substrate. We call the technology Electron Attachment for Hydrogen Activation.
Sikama International’s UP1200 Electron Attachment (EA) version furnace is a five heat zone, linear tunnel process oven that is capable of handling up to 300 mm wafers and can process 60 wafers per hour. The furnace is designed to be used to remove metal oxides from solder bumps on UBM wafers and solder caps from copper pillar wafers via the electron attachment technology, which activates hydrogen to produce hydrogen anions and then reflow the solder to their final shape in the absence of traditional organic flux or formic acid in vacuum processes. The furnace is capable of operating at temperatures up to 400°C. The wafers achieve a consistent heat profile based on non-contact heating in combination with forced thermal convection and the wafers are conveyed through the furnace via unique roller transport system. The system may be operated with an ambient pressure with an atmosphere forming gas mixture of 5% H2/95% N2 in the activation zones and nitrogen in the remaining process zones.
Contact: Sikama International Inc., 118 E Gutierrez Street, Santa Barbara, California, 93101
Phone: 805-962-1000 Fax: 805-962-6100 email: firstname.lastname@example.org web: www.sikama.com