TKC Co., Ltd.

280 Sihwa-ro, Danwon-gu
Ansan-si, Gyeonggi-do,  15617

Korea (South)
  • Booth: 5502

New Electroplating equipment Pioneer for Semiconductor

Welcome to TKC! Semiconductor/PCB Wet Process MC Provider.

TKC which has supplied plating and surface processing equipments for mass production since 1996 and succeeded in developing package related plating equipments since 2009 is moving forward to the specialized manufacturing company for mass production Wafer Electroplating Equipment with productivity and quality competitiveness.

AEGIS is the optimized mass production type of Electroplating equipment for Bump, RDL, TSV, Interposer, etc. those applied to semiconductor application products.

Semiconductor EP(Electro Plating) Equipment Provider. TKC

1. Wafer EP equip. (RDL, BUMP, TSV)
2. Single Cell EP equip.
3. Wafer Cu-Ni-Au Electroplating equip. for LED
4. Pattern copper Electroplating equip. (Vertical Continuous Plating)
5. Panel via fill copper plating equip. (Vertical Continuous Plating)
6. Full auto Ni-Au Electroplating equip.
7. Non-contact vertical DF / SR develop equip.
8. Vertical auto desmear / PTH

 Press Releases

  • Our Aegis-1000 Series is the fully automatic mass production type electroplating machine provided in the form of RDL, TSV, Bump by using Ion plating on Wafer Surface with metal material to optimize the electrical efficiency and characteristics in semiconductor process.

    Over 90% of equipment components are localized and we are not only continuously developing our technology to reduce the plating deviation, but also accumulated theoretical technologies through simulation of flow, electric field, and mass production quality. We are creating the era of domestic plating equipment as a new challenger in the field of semiconductor plating equipment field which relied 100% on the overseas market. We have a confidence that it will secure the price competitiveness of product with domestic plating machine which has high quality and productivity based on needs of Semiconductor manufacturers and it will take the important roll to prevent the advanced technology from outflowing to overseas.

    We are recently in process of the joint development evaluation with our fully automatic plating equipment (AEGIS Demo Ver) and developing domestic chemical with demanding companies. Some of products were already applied on mass production successfully. This is regarded as new harmony of domestic equipment and chemical in the structure of high priced overseas' equipment and chemical and it created the competitive new market atmosphere in the field for making the opportunity for the objective assessment of developed domestic chemicals.

    We also have continuously progressed the development of semiconductor machine based on the technology of PCB surface treatment equipment for last 20 years and are also accelerating the development of new PCB area and semiconductor like PLP recently.

    We have been supplying a variety of semiconductor type of plating surface treatment equipment such as next generation (Package level Fine Pitch) automatic Non-contact developer which can keep up with the equipment demand of PCB area according to the change in the semiconductor market and automatic semiconductor level PCB plating equipment which is capable of plating u-Bump on Square Panel (PCB).

    Our participating in this year Semicon Korea 2017 is to celebrate 30 years in the semiconductor industry and is very meaningful for us to achieve the goal for success and mass production in the semiconductor plating equipment field which is very difficult to assess in and it'll be the significant new opportunity for us to establish ourself as a new domestic semiconductor partner.


  • Semiconductor Electro Plating AEGIS-1000 Series
    It is the fully automatic mass production type electroplating machine provided in the form of RDL, TSV, Bump by using Ion plating on Wafer Surface with metal material to optimize the electrical efficiency and characteristics in semiconductor process....

  • Semiconductor EP Equipment  AEGIS-1044EP

     Fully automatic equipment for mass production

    ● characteristics

    - The AEGIS-1000 Series ideally offers the exceptional plating thickness uniformity and the improvement of production reliability combined with the UPH competitiveness foradvanced packaging products

    • Target wafer : 4,6,8 and 12 inch, 8/16/24cell
    • Application : Bump, RDL, Cu Pillar, TSV 

    ● Specification

    • Excellent uniformity
    • High throughput
    • Various Wafer handling(GWSS, WSS, Si)
    • Competitive Cost of Ownership
    • Excellent sealing from chemical
    • Quick Delivery
    • Easy Maintenance & Flexibility
    • Convenient User interface
    • Built-in spin rinse and dry unit(dry in & dry out)
    • Equipped with automatic cathode cleaner
    • Optional: automatic chemical dosing system

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