Sono-Tek Corporation

2012 Route 9W
Milton,  NY  12547-5017

United States
  • Booth: 5378

Sono-Tek’s ultrasonic coating technology is used for applications in which material consumption, uniformity, repeatability, and control are required. Our ultrasonic technology is well known in the semiconductor industry for precision photoresist coatings. Sono-Tek’s new SPT200 photoresist coating machine is the perfect tool for providing uniform photoresist coverage of deep well topographies such as MEMs and other challenging applications where spin coating is not adequate. By forming very small and controlled droplets, this unique technology allows for uniform photoresist coverage of deep well topographies such as MEMs and other challenging applications where spin coating is not adequate.  Other applications include flux dispensing for flip chip applications as well as thin film solar/display applications like TCO layers, nano suspensions (CNT, graphene, nano-wires, etc), OPV polymers, AR, and CIGS active layers.  Visit for more information.

 Press Releases

  • Sono-Tek has supplied precision ultrasonic coating equipment to the semiconductor industry since the 1980s. Advances in MEMs wafer technology have caused challenges for the industry in coating deep well topographies using conventional spin coating methods. Ultrasonic spray offers an ideal solution, with the ability to coat all areas of high aspect ratio trenches uniformly. Sono-Tek has combined their patented ultrasonic nozzle technology with all the necessary systems to create the ultimate solution for spraying photoresist onto MEMs wafers. The SPT200 system has been carefully developed to be the perfect full coating solution for 100 to 300mm wafers with high aspect ratios. Go to to learn more or email us at​


  • SPT200 Spray Photoresist Tool
    SPT200 is a fully enclosed standalone ultrasonic coating system for spraying photoresist onto 100, 150, 200 & 300mm wafers for precision semiconductor R&D & manufacturing. It features very high uniformity, even on difficult high aspect ratio topographies....

  • Designed for processes where spin coating is unable to provide adequate uniform coverage of high aspect ratio MEMs with deep trenches, Sono-Tek’s NEW SPT200 has a number of proprietary features that are specially configured for these spray processes. Configured with Sono-Tek’s patented ultrasonic spra​y nozzles, the SPT200 features integrated bottom draw wafer exhaust and 360 degree cleaning and overspray containment for efficient, no mess removal of any overspray. A HEPA filtered intake, auto nozzle cleaning purge,​ precision temperature contorl, and automatic wafer ​lockdown and unload.

    ​Ultrasonic nozzles, by nature of their soft, atomized, targeted spray result in up to 90% reduction in material consumption with non-clogging, highly repeatable performance and very little overspray. SPT200 is configured with a 200mm standard heated wafer chuck, with 100, 150, or 300 mm options available.​

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