Designed for processes where spin coating is unable to provide adequate uniform coverage of high aspect ratio MEMs with deep trenches, Sono-Tek’s NEW SPT200 has a number of proprietary features that are specially configured for these spray processes. Configured with Sono-Tek’s patented ultrasonic spray nozzles, the SPT200 features integrated bottom draw wafer exhaust and 360 degree cleaning and overspray containment for efficient, no mess removal of any overspray. A HEPA filtered intake, auto nozzle cleaning purge, precision temperature contorl, and automatic wafer lockdown and unload.
Ultrasonic nozzles, by nature of their soft, atomized, targeted spray result in up to 90% reduction in material consumption with non-clogging, highly repeatable performance and very little overspray. SPT200 is configured with a 200mm standard heated wafer chuck, with 100, 150, or 300 mm options available.