95 Highway 22W
Milledgeville,  GA  31061

United States
  • Booth: 6544

CCGA - Column Grid Array and Daisy Chain BGA

CCGA - Column Grid Array typically used in mil/aero/defense applications.

Columns absorb large stresses due to the inherit mismatch of the material's coefficient of temperature expansion (CTE) between a ceramic module and PCB circuit board.

Temperature excursions  stretched and squeezed 2.5mils (63um), or more, from corner to corner as the temperature swings 100 degrees Celsius.

The solution for overcoming CTE mismatching is to replace solder balls with solder columns, making a device known as a Ceramic Column Grid array (CCGA).

Solder columns are compliant and absorb stresses caused by stretching and pulling in applications involving high vibration, shock and varying temperatures.

CCGA have been used for decades by well known chip makers such as IBM, Xilinx, Atmel and Microsemi (previously Actel), just to name a few.

 Press Releases

  • TopLine Offers Tanaka Bonding Wire for Universities, Labs, Small-volume Users

    Makes Needed Wire Available in Affordable Quantities for Researchers

    Irvine, California, USA – TopLine, a leading designer and manufacturer of semiconductor packages and PCB assemblies, has started a new service that makes it much easier for Universities, research facilities, laboratories, and small-volume users to obtain bonding wire manufactured by Tanaka, TopLine's One Spool policy allows users to purchase as few as a single spool of bonding-wire. TopLine's policy is welcomed by customers who had been previously forced to purchase large lots of bonding-wire.

     “Other manufacturers of bonding wire typically require customers to buy minimum order quantities, which might be 10 to 20 spools,” Martin Hart, TopLine’s President, states. “But TopLine's M.O.Q. is just One Spool. Our goal is to make it easy for small-volume customers to have quick, hassle-free access to Tanaka’s world -class quality bonding wire, helping Universities, laboratories and R&D projects helps to advance technology, and ultimately the industry that supports all of us,” he added. Examples of Tanaka bonding wire will be on display in the TopLine booth, #6544, at the Semicon West 2017 trade show in San Francisco, California July 11-13, 2017.

    Bonding wire is used in a wide range of applications, mostly involving wiring silicon die inside IC packages or bonding chips directly to PC boards, known as Chip on Board (C.o.B) . The wire is also used to build prototype packages as well as small scale production packages for today's North American market.

    TopLine offers a full range of bonding wire in four alloys: Gold, Aluminum, Silver, and Copper, as well as flat gold ribbon used in RF Microwave and certain segments of the solar industry. TopLine offers standard lengths on spools:  50m, 100m, 300m, 500m and 1000m, depending how much the customer needs on the spool. Wire is packaged on two-inch spools as well as half-inch spools for industry standard manual or automated bonding machines.

    For more information, contact TopLine Corporation, Tel (800) 776-9888; Email:

  • Irvine California, USA – TopLine and NASA will present a joint paper, titled “Practical Design Considerations for Particle Impact Dampers (PID) to Prevent Random Vibration Failures in Printed Circuit Boards,” at the PCB West Conference, Sept 12 – 14, 2017, in Santa Clara, California.

    TopLine was recently granted an exclusive worldwide license by NASA to manufacture “Particle Damping for Vibration Mitigation for Circuit Cards.”

    Presenters will be Ron Hunt from the NASA Marshall Space Flight Center, and Martin Hart, President of TopLine Corporation. Ron Hunt is the inventor of this new PID technology that attenuates destructive vibratory forces to reduce damage in PCBAs. This innovation extends the life of the assembly, including IC packages that operate under harsh environmental conditions including thermal stress and vibration.

    The presentation will explain a novel way to attenuate vibrations in PCBs by using a simple component known as a PID (Particle Impact Damper) that is attached directly to the PC board. The PID itself is filled with Tungsten spheres that deflect the board in the opposite direction while the board is vibrating. The PID helps keep the board remain stable during massive random vibration. NASA made a technology transfer of the Patent US9521753 B1 to TopLine in September 2016.

    The Particle Impact Damper (PID) is mounted near the geometric center of the PCB where vibratory forces are the greatest. The kinetic energy is transferred to the PID to dampen vibration in the circuit assembly. PID provides better reduction in vibration than alternative methods such as adding heavy metal supports, bumpers or increasing the thickness of the PCB.

    PIDs are commercially-available COTS components. Mounting methods include surface mount soldering, snap-in through-hole, screw mounting, and epoxy mounting with permanent adhesives. Engineering development kits are currently under development. To learn more, check new web site http://www.for.Space .

    Visit the TopLine booth #6544 at Semicon West, San Francisco, July 11-13, 2017

  • Irvine, California, USA – TopLine, a leading designer and  manufacturer of electronic components and packaging solutions, will exhibit its MSC Series of Micro-coil springs, a novel interconnect for CCGA (Ceramic Column Grid Array) IC packages for harsh environments. In tests using daisy chain test vehicles, Micro-coil springs absorbed extreme shock of up to 50,000g before failing. Commercial applications include aerospace, avionics, military, down-hole oilfield drilling and automotive electronics. Test results were initially presented by NASA at IEEE CPMT 2012.

    MSC technology and its benefits will be explained and discussed by TopLine’s President, Martin Hart, in the TopLine booth, #6544, at the Semicon West in San Francisco, California July 11-13, 2017.

    Engineers at NASA's Marshall Space Flight Center initially developed this novel interconnection structure for integrated circuit packages. This innovation replaces traditional CCGA solder columns with the potential to extend life under harsh environments, extreme thermal stress, vibration and shock. The Micro-coil Spring technology provides flexibility in three dimensions between the ceramic (or plastic) package and the PCB board. This technology offers a distinct improvement over cast Pb90/Sn10 solder columns or copper-ribbon-wrapped Pb80/Sn20 solder columns, which have limited flexibility under shear stress. MSC technology offers a novel alternative, providing better flexibility in high temperature and harsh environments.

    Micro-coil springs are fabricated from beryllium copper C17200 (Alloy 25) per ASTM B 197. The coils are post-plated with electro-deposited Sn60/Pb40, 100 micro-inches minimum thickness. Micro-coil springs may also be used in place of solder balls on plastic PBGA packages. After reflow at normal tin-lead temperature profiles, Sn63/Pb37 solder paste forms a fillet around the double coil ends of the spring.

    To learn more, visit

     Visit the TopLine booth #6544 at Semicon West 2017.

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