Si10 was designed for WLCSP post sawn test application in singulated die format. Die was picked from Sawn wafer for direct docking test and 5S-AOI follow by tape and reel process.
- Maximum 12” wafer handling capability
- Reel input with De-taping module
- Direct docking test capability with multiple sites
- Full inspection for die back and front active area with minimum 6 cameras vision system.
- Vision system with Side wall inspection.
- Ideal tool for post sawn test application
- Enhance Post seal inspection.
- Reject bad die to wafer pack.
- Optional input/output: Jedec tray and Waffle pack.