Partow Technologies LLC

1487 Poinsettia Ave.
Suite 119
Vista,  CA  92081

United States
  • Booth: 6647

Partow Technologies provides room-temperature wafer bonding equipment and services. The company provides wafer bonding equipment for up to 100mm substrates based on atomic diffusion bonding method.  

  •  The room temperature bonding allows to bond materials with different thermal expansion coefficients since no heating is required. No thermal strain on the bonded wafers. 
  • Bond strength is greater than bonded materials
  • The only requirement for wafers is a polished surface
  • Semiconductor, oxides, metals .... can bond to form functional devices

Example bonded materials: Silicon, Lithium Niobate, Lithium Tantalate, LYSO, Quartz, GaAs, InP, Saphire ... 

The bonding is performed in ultra-high vacuum (UHV) chamber. The wafer surfaces are plasma activated and are bonded inside the ultra-high vacuum chamber. 

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