July 12-14, 2016
San Fransisco, CA
Partow Technologies provides room-temperature wafer bonding equipment and services. The company provides wafer bonding equipment for up to 100mm substrates based on atomic diffusion bonding method.
Example bonded materials: Silicon, Lithium Niobate, Lithium Tantalate, LYSO, Quartz, GaAs, InP, Saphire ...
The bonding is performed in ultra-high vacuum (UHV) chamber. The wafer surfaces are plasma activated and are bonded inside the ultra-high vacuum chamber.
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