3D-Micromac AG

Technologie-Campus 8
Chemnitz,  D-09126

Germany
http://www.3d-micromac.com
  • Booth: 1645

3D-Micromac AG - Micromachining Excellence
3D-Micromac is the leading specialist in laser micromachining. Our team of experts develop processes, machinery and complete systems at the highest technical and technological level. 3D-Micromac systems and services have been successfully implemented in various high-tech industries worldwide including photovoltaic, semiconductor, glass and display industries, micro diagnostics, and medical technology. Our target is to completely satisfy customer demands even on the most complex projects.

3D-Micromac adheres to high-performance and future-oriented processes at high production efficiency. Our technologies have set international standards for true innovation.

Our subsidiary:

3D-Micromac America, LLC
2151- 40 O’Toole Ave
San Jose, CA 95131
USA
Email: sales@3d-micromac.com


 Press Releases

  • microPRO™ RTP leverages state-of-the-art optics, line scan and step-and-repeat spot options, and multiple wavelengths to provide highly versatile laser platform

    Chemnitz, Germany, June 25, 2018—3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, medical device and electronics markets, today unveiled the microPRO™ RTP—its new laser annealing system designed to enable several key process steps in semiconductor, power device and MEMS manufacturing. Combining a state-of-the-art laser optic module with 3D-Micromac’s modular semiconductor wafer processing platform, the microPRO RTP provides selective annealing with high repeatability and throughput in a versatile system.

    The microPRO RTP features a line scan option for vertical selective annealing and a step-and-repeat spot option for horizontal selective annealing, as well as three optional laser wavelengths (near infrared, green and ultraviolet). The microPRO RTP addresses a variety of applications, including:

    • Dopant activation for insulated gate bipolar transistors (IGBTs), as well as activation of backside illuminated (BSI) CMOS image sensors and amorphous silicon (a-Si) – the microPRO RTP uses a high-speed line scan with excellent energy homogeneity and repeatability to provide precise localization of the field stop layer, which minimizes heat transference to the front-side of the wafer
    • Ohmic contact formation in silicon carbide (SiC) power devices to improve resistance – using spot scanning with short laser pulses, microPRO RTP can process the entire metalized backside of SiC wafers, forming ohmic interfaces and curing grinding defects, while preventing the generation of large carbon clusters and heat-related damage to the front-side of the wafer
    • Giant magneto resistive (GMR) and tunneling magneto resistive (TMR) sensor manufacturing – using a selective step-and-repeat spot and variable laser energy, microPRO RTP can selectively heat functional areas on the sensor to form and orient the magnetic fields for these MEMS sensor types

    “As microelectronics adopt 3D/stacked architectures to achieve more functionality, manufacturers need annealing solutions that can process the surface layers of their devices without affecting buried structures underneath. The migration to new materials and heterogeneous integration adds even more complexity to the annealing process, driving the need for selective exposure of functional areas, which only selective laser annealing can provide. Leveraging our years of experience in providing laser solutions to the semiconductor and microelectronics market, 3D-Micromac is pleased to offer our new microPRO RTP laser annealing solution, which provides the selectivity, flexibility and throughput our customers need to meet their unique annealing requirements,” stated Hans-Ulrich Zühlke, product manager at 3D-Micromac.

    The microPRO RTP provides numerous advantages compared to existing annealing methods, including:

    • High precision and repeatability in both X and Y directions
    • High selectivity to different substrates and films, with multiple options for laser pulse length, energy and overlap to ensure no damage to the area surrounding the target site
    • Very high energy homogeneity
    • Precise process monitoring
    • Flexibility to handle substrate diameters ranging from 50mm up to 300mm

    Media, analysts and potential customers interested in learning more about 3D-Micromac’s laser micromachining solutions, including the microPRO RTP, are invited to visit the company at SEMICON West 2018, July 10-12 at the Moscone Convention Center in San Francisco, Calif., in South Hall, booth #1645. More information on microPRO RTP is also available on https://3d-micromac.com/laser-micromachining/products/micropro/.

    About 3D-Micromac

    Founded in 2002, 3D-Micromac AG is the industry leader in laser micromachining, delivering powerful, user-friendly and leading-edge processes with superior production efficiency. We develop processes, machines and turnkey solutions at the highest technical and technological level. 3D-Micromac systems and services have been successfully implemented in various high-tech industries worldwide, including photovoltaic, semiconductor, glass and display industries, micro diagnostics, and medical technology. For more information, visit the company’s website at http://www.3d-micromac.com.

    Company Contact

    Mandy Gebhardt
    Team Leader Marketing and Public Relations
    3D-Micromac AG
    Tel: +49 371 40043-26
    E-Mail: gebhardt@3d-micromac.com

  • microPREP 2.0 Provides Order of Magnitude Time and Cost Savings Compared to Traditional Sample Preparation Methods

    Chemnitz, Germany, July 9, 2018—3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, medical device and electronics markets, today introduced the microPREP 2.0 laser ablation system for high-volume sample preparation of metals, semiconductors, ceramics and compound materials for microstructure diagnostics and failure analysis (FA).

    Built on a highly flexible platform with a small table-top footprint, the microPREP 2.0 allows for easy integration into FA workflows. Developed jointly with Fraunhofer Institute for Microstructure of Materials and Systems (IMWS), the microPREP 2.0 complements existing approaches to sample preparation such as focused ion beam (FIB) micromachining, offering up to 10,000 times higher ablation rates and therefore an order of magnitude lower cost of ownership (CoO) compared to FIB. As the first stand-alone, ultrashort pulsed laser-based tool for sample preparation, the microPREP 2.0 brings additional unique capabilities, such as enabling large-area and 3D-shape sampling to allow for more comprehensive testing of complex structures.

    Sample preparation an enabling step for semiconductor failure analysis

    Cutting and preparing samples from semiconductor wafers, dies and packages for microstructure diagnostics and FA is an essential but time-consuming and costly step. The primary method of sample preparation used in semiconductor and electronics manufacturing today is FIB micromachining, which can take several hours to prepare a typical sample. FIB only allows for very small sample sizes, and precious FIB time is wasted by “digging” excavations needed for cross-sectional imaging in a scanning electron microscope or making a TEM lamella. Reaching larger depths or widths is severely restricted by the limited ablation rate.

    3D-Micromac’s microPREP 2.0 significantly accelerates these critical steps, bringing sample preparation for semiconductor and materials research to a new level. By off-loading the vast majority of sample prep work from the FIB tool and relegating FIB to final polishing or replacing it completely depending on application, microPREP 2.0 reduces time to final sample to less than one hour in many cases.

    “This award-winning tool brings unprecedented flexibility into sample prep. We at Fraunhofer IMWS are facing the need for targeted, artefact-free and most reliable preparation workflows to be able to serve our industry customers with cutting-edge microstructure diagnostics. Made for diverse techniques like SEM inspection of advanced-packaging devices, X-ray microscopy, atom probe tomography, and micro mechanics, microPREP was developed jointly with
    3D-Micromac to close gaps in preparation workflows,” said Thomas Höche, Fraunhofer IMWS.

    3D-Micromac Launches Laser Sample Preparation Solution

    Last month, 3D-Micromac and Fraunhofer IMWS received the prestigious TUV SUD Innovation Award for their collaboration on the development of microPREP 2.0. The annual prize honors successful cooperation between small and medium-size enterprises and research institutions. It is administered by TUV SUD, a leading technical service corporation serving the industry, mobility and certification segments.

    Key benefits of microPREP 2.0 include:

    • Much higher ablation rate compared to FIB (by several orders of magnitude)
    • Up to an order of magnitude lower CoO compared to classical FIB workflow
    • High degree of automation due to recipe-based, ergonomic user interface
    • Extremely high energy densities can be focused in very small areas (allowing for operation in the multi-photon absorption regime needed to machine at-wavelength-transparent materials and enabling stable process windows)
    • Virtually no structural damage from local heating due to the platform’s very short pulse lengths (pico-second range)
    • Providing larger-sized samples with micron-level precision—enabling multi-site FA on whole chip or package areas in a much shorter period of time and a multitude of workflows delivering samples for various FA techniques
    • Enables the creation of samples with complicated/3D shapes to enable more comprehensive analysis of certain structures, such as through silicon vias (TSVs) or even complete systems-in-package (SiP)
    • Laser processing without elemental contamination

    microPREP 2.0 can be used for a variety of semiconductor sample preparation applications, including: in-plane geometries and bulk samples; cross-sections; box milling (such as for diagnostics of electrical connections and 3D chip-level structures); and full line cut (for complex investigations of complete devices). Samples can be moved between microPREP 2.0 and FA tools using the same pin stubs and holders, which provides even greater ease of use and time savings.

    “The growing complexity of microelectronics manufacturing is driving the need for faster, more reliable and cost-effective, and artifact-free sample preparation techniques at the micron scale,” stated Jan Klinger, chief sales officer at 3D-Micromac. “Building on our extensive expertise in laser micromachining, 3D-Micromac can now offer an optimal sample preparation solution for this market. By off-loading the coarse and time-consuming task of sample preparation to a simple and fast support tool, microPREP frees up our customers’ time to focus their efforts on fab-critical issues like trouble-shooting process and yield problems.”

    Media, analysts and potential customers interested in learning more about 3D-Micromac’s laser micromachining solutions, including microPREP 2.0, are invited to visit the company at SEMICON West 2018, July 10-12 at the Moscone Convention Center in San Francisco, Calif., in South Hall, booth #1645. More information on microPREP is also available on http://3d-micromac.com/laser-micromachining/products/microprep/.

    About 3D-Micromac

    Founded in 2002, 3D-Micromac AG is the industry leader in laser micromachining, delivering powerful, user-friendly and leading-edge processes with superior production efficiency. We develop processes, machines and turnkey solutions at the highest technical and technological level. 3D-Micromac systems and services have been successfully implemented in various high-tech industries worldwide including photovoltaic, semiconductor, glass and display industries, micro diagnostics, and medical technology. For more information, visit the company’s website at http://www.3d-micromac.com.

    Company Contact: Agency Contact:

    Mandy Gebhardt

    Manager, Marketing and Public Relations

    3D-Micromac AG

    Tel: +49 371 40043-26

    E-Mail: gebhardt@3d-micromac.com

    David Moreno

    Principal

    Open Sky Communications

    Tel: +1.415.519.3915

    E-Mail: dmoreno@openskypr.com


 Products

  • microPRO RTP
    Selective laser annealing system for magnet sensor formation ...

  • Combining a state-of-the-art laser optic module with 3D-Micromac’s highly modular semiconductor platform, the compact microPROTM RTP provides selective annealing with high repeatability and high throughput. The system features a selective step-and-repeat spot for magnet sensor formation. The microPROTM RTP provides numerous advantages compared to existing annealing methods.

    microPRO™ RTP offers:

    • High precision in both X and Y directions
    • Excellent selectivity for different sensor types
    • Multiple options for pulse energy and exposure area geometry
    • Free programable magnetic field strength and orientation
    • Very high energy homogeneity
    • Integrated process monitoring
  • microDICE
    High-performance microDICE™ laser dicing system separates wafers into dies using TLS-Dicing™ technology (Thermal-Laser-Separation)....

  • 3D-Micromac’s high-performance microDICE™ laser dicing system separates wafers into dies using TLS-Dicing™ technology (Thermal-Laser-Separation). microDICE™ significantly reduces the dicing cost per wafer compared to traditional separation technologies. At the same time, cleaving with microDICE™ provides outstanding edge quality while increasing yield and process throughput. This is particularly true for silicon carbide (SiC) substrates, which are hard and brittle.

    microDICE™ offers:

    • Significantly higher throughput, with dicing speeds up to 300 mm/s
    • Minimal cost of ownership
    • The ability to produce more dies per wafer by reducing street width

    http://3d-micromac.com/laser-micromachining/products/microdice/

  • microCELL
    Laser Systems for Processing Silicon Solar Cells ...

  • The microCELL™ production solutions, such as high performance laser processing for Laser Contact Opening (LCO) of high efficient PERC solar cells as well as laser dicing of full cells into half cells with Thermal Laser Separation (TLS-Dicing™), are designed to meet cell manufacturers‘ demands for achieving maximum throughput rates and yield while diminishing cell manufacturing costs.

    3D-Micromac‘s microCELL™ TLS is a highly productive laser system for separation of standard silicon solar cells into half cells. The microCELL™ TLS meets cell manufacturers‘ demands by retaining the mechanical strength of the cut cells. The ablation free process guarantees an outstanding edge quality. Laser processing on-the-fly and an innovative handling concept enable maximum throughput and yield in the full-scale manufacturing of crystalline half cells.

    3D-Micromac‘s microCELL™ OTF is a highly productive laser system for processing of mono- and polycrystalline silicon solar cells. The microCELL™ OTF meets cell manufacturers‘ demands for increasing the efficiency, e.g. of PERC solar cells, by precise surface structuring, low operating costs, and highest availability. Laser processing on-the-fly and an innovative handling concept enable maximum throughput and yield in the mass production of crystalline solar cells. The contactless cell handling enables processing without surface defects and microcracks.

    http://3d-micromac.com/laser-micromachining/products/microcell/


 Additional Info

New Exhibitor:
No
New Products:
Yes
Displaying Equipment:
Yes
Product Demonstrations:
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Please indicate which industries/technologies your company serves
MEMS, Photovoltaic, Plastic/organic/flexible electronics, Power Semiconductors, Semiconductor

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