Veeco Instruments, Inc.

1 Terminal Dr
Plainview,  NY  11803

United States
http://www.veeco.com
  • Booth: 6070

Veeco (and Ultratech, a division of Veeco) is a leader in thin film process technologies, advanced packaging lithography, wet etch & clean, 3D wafer inspection, laser spike annealing and laser melt, atomic layer deposition, molecular beam epitaxy, ion beam technologies, and metal organic chemical vapor deposition systems. We are a technology company that develops, manufactures, sells and supports process equipment designed to meet the demands of key global trends such as enhanced mobility, increased connectivity, and energy efficiency. Our products and services help our customers optimize the manufacture of semiconductors, memories, EUV mask blanks, VCSELs,  advanced LEDs and displays, power electronics, compound semiconductors, hard disk drives, MEMS, wireless chips and more. With equipment designed to optimize performance, yield and cost of ownership, we hold technology leadership positions in all these served markets.


 Press Releases

  • Growing Demand for Advanced Packaging in the Memory Market Highlights Value of Veeco’s
    High Volume Manufacturing Lithography Systems

    PLAINVIEW, New York, July 9, 2018 – Veeco Instruments Inc. (Nasdaq: VECO) today announced that one of the world’s leading memory chip manufacturers has ordered multiple AP300™ lithography systems to support the fast growing demand for DRAM with copper (Cu) pillars. The company selected the Veeco tools for their versatility in addressing advanced packaging applications, proven reliability in supporting high volume manufacturing and low total cost of ownership.

    This approach echoes a larger industry trend, with more and more memory manufacturers exploring the use of Cu pillars in DRAM interconnect applications due to their higher input/output (I/O) density, improved electrical performance and better thermal efficiency. “Within the DRAM market, the interconnect is shifting from wire bond to flip chip,” said Jan Vardaman, president of semiconductor packaging analyst firm TechSearch International, Inc. “We project that over the next three years, the annual number of flip chip interconnects in DRAM will grow 29 percent on a unit volume basis.”

    The AP300 is part of a family of lithography systems built on Veeco’s customizable Unity Platform™, which delivers superior overlay, resolution and side wall profile performance, driving highly automated, cost-effective manufacturing for customers. The system is particularly well suited for Cu pillar, fan-out, through-silicon via (TSV) and silicon interposer applications. A low risk, low cost, high volume manufacturing solution, the AP300 is staged to support rapid market adoption of advanced packaging applications among memory manufacturers.

     “The growing demand for innovative, alternative solutions to wire bonding in memory presents a strong opportunity for Veeco,” said Rezwan Lateef, vice president and general manager of lithography products at Veeco. “Furthermore, this significant customer adoption validates the AP300’s ability to address advanced packaging applications in a broader high-volume production market. To meet this demand, we are strengthening our regional technical staff to support numerous memory manufacturers looking to fast-track adoption.”

    Veeco will be at Booth #6070 at SEMICON West in San Francisco, CA, July 10-12, 2018.

    About Veeco

    Veeco (NASDAQ: VECO) is a leading manufacturer of innovative semiconductor process equipment.  Our proven MOCVD, lithography, laser annealing, ion beam and single wafer etch and clean technologies play an integral role in producing LEDs for solid-state lighting and displays, and in the fabrication of advanced semiconductor devices. With equipment designed to maximize performance, yield and cost of ownership, Veeco holds technology leadership positions in all these served markets.  To learn more about Veeco's innovative equipment and services, visit www.veeco.com.

    Media Contact:                                    Investor Relations Contact:

    David Pinto                              Anthony Bencivenga

    408-325-6157                          516-677-0200 x1308

    dpinto@veeco.com                  investorrelations@veeco.com  

  • PLAINVIEW, N.Y. -- Veeco Instruments Inc. (Nasdaq:VECO) announced that Lumentum Holdings Inc. has ordered the Veeco K475i™ Arsenide/Phosphide (As/P) Metal Organic Chemical Vapor Deposition (MOCVD) System for production of its advanced semiconductor components which address the 3D sensing, high-speed fiber-optic communications and laser-based materials processing end-markets. Lumentum, headquartered in Milpitas, Calif., is a leading manufacturer of innovative optical and photonics products.  

    “The global communications, industrial and consumer electronics markets that our proprietary semiconductor lasers address are growing rapidly,” said Susan Wang, vice president of manufacturing at Lumentum. “We chose Veeco’s K475i system with its high capacity/throughput, uniformity of quality, repeatability and exceptional performance to help expand our capacity and better address these growth opportunities. We have a longstanding relationship with Veeco and look forward to future collaboration together.”

    The K475i system incorporates proprietary TurboDisc® and Uniform FlowFlange™ MOCVD technologies. These innovations allow Veeco customers to improve compositional uniformity and dopant control while reducing cost-per-wafer by up to 20 percent compared to alternative systems through higher productivity, best-in-class yields and lower operating expenses. Application areas include lighting, solar, laser diodes, vertical-cavity surface-emitting lasers (VCSELs), pseudomorphic high electron mobility transistors (pHEMTs) and heterojunction bipolar transistors (HBTs).

    “A leading player in the optical communications and commercial laser markets, Lumentum is well positioned to capitalize on the growing demand for next-generation laser and optical devices using Veeco MOCVD technology,” said Peo Hansson, Ph.D., senior vice president and general manager of MOCVD Operations at Veeco. “As customers look for technologies that enable demanding new applications in increasingly competitive markets, many leading photonics, power electronics and LED device manufacturers continue to choose our proven MOCVD systems that deliver strong wafer uniformity and the lowest cost of ownership.”

    About Lumentum

    Lumentum (NASDAQ:LITE) is a market-leading manufacturer of innovative optical and photonic products enabling optical networking and commercial laser customers worldwide. Lumentum's optical components and subsystems are part of virtually every type of telecom, enterprise, and data center network. Lumentum's commercial lasers enable advanced manufacturing techniques and diverse applications including next-generation 3D sensing capabilities. Lumentum is headquartered in Milpitas, California with research and development, manufacturing, and sales offices worldwide. For more information, visit www.lumentum.com.

    About Veeco

    Veeco (NASDAQ:VECO) is a leading manufacturer of innovative semiconductor process equipment. Our proven MOCVD, lithography, laser annealing, ion beam and single wafer etch and clean technologies play an integral role in producing LEDs for solid-state lighting and displays, and in the fabrication of advanced semiconductor devices. With equipment designed to maximize performance, yield and cost of ownership, Veeco holds technology leadership positions in all these served markets. To learn more about Veeco's innovative equipment and services, visit www.veeco.com.

    Media Contact:   

    David Pinto           

    408-325-6157

    dpinto@veeco.com

    Investor Relations Contact:

    Anthony Bencivenga

    516-677-0200 x1308

    investorrelations@veeco.com

  • PLAINVIEW, N.Y., -- Veeco Instruments Inc. (Nasdaq:VECO)  announced that ON Semiconductor (Nasdaq:ON) has ordered its Propel® High-volume Manufacturing (HVM) Gallium Nitride (GaN) Metal Organic Chemical Vapor Deposition (MOCVD) system. Based on its successful beta evaluation of the Propel HVM tool, ON Semiconductor ordered the production-level Propel system for GaN power electronics manufacturing. As the industry’s first single-wafer cluster platform, the Propel GaN MOCVD system is specifically designed for high-voltage power-management devices used in data centers; automotive, information and communication technology; defense; aerospace and power distribution systems, among other applications

    “Our prior learning with Veeco’s K465i™ GaN MOCVD system drove us to investigate the Propel HVM platform for our production ramp,” said Marnix Tack, PhD, senior director of corporate R&D and Open Innovation at ON Semiconductor. “The beta test results demonstrated superior device performance with high uniformity and within-wafer and wafer-to-wafer repeatability, while meeting our cost-of-ownership targets for six- and eight-inch wafers. As such, the Propel HVM system proved to be the most suitable platform for our power electronics manufacturing needs.”

    The Propel HVM platform is based on Veeco’s innovative single-wafer system with proprietary IsoFlange™ and SymmHeat™ technologies that provide homogeneous laminar flow and uniform temperature profile across the entire wafer. The system enables production of power electronics, laser diodes, RF devices and advanced LEDs with higher performance and production yields while ensuring very low cost-of-ownership.

    “The Propel HVM platform is rapidly gaining traction in the industry as innovative companies like ON Semiconductor recognize the benefits of GaN-on-silicon, which will partially replace current silicon technology for power electronics,” commented Peo Hansson, PhD, senior vice president and general manager of Veeco MOCVD operations. “With its highly controlled doping, run-to-run stability, superior wafer uniformity, high productivity and uptime, Propel HVM extends the benefits of our TurboDisc® platform to a unique single-wafer architecture. These capabilities benefit customers that seek a superior solution for manufacturing while providing a path for scaling to eight-inch wafers and expansion to RF and other advanced applications.”

    GaN is a wide band gap semiconductor material with specific advantages over conventional technologies such as gallium arsenide (GaAs) and silicon carbide (SiC). GaN has enormous potential in the short term due to its benefits in terms of thermal behavior, efficiency, weight and size. According to market research firm Yole Développement, the GaN power device business was worth $14 million in 2016, and projects that it will reach $460 million by 2022, with a compound annual growth rate (CAGR) of 79 percent. GaN-based devices will be used increasingly in RF amplifiers, LEDs and high voltage applications among others, primarily due to their abilities to operate at high frequency, power density and temperature with improved efficiency and linearity. 

    Veeco is discussing the power of its innovative MOCVD and wet etch systems in the “5G: Where Are We and What’s Next?” track at the CS International Conference this week in Brussels, Belgium. Somit Joshi, senior director of MOCVD marketing is presenting a session titled, “Enabling GaN RF and Power Electronics through Innovative MOCVD and Wet Etch Process Technologies,” on Wednesday, April 11, and the Veeco team will also be accepting the CS Industry 2018 Award for Innovation for its GENxcel™ R&D MBE System at the awards ceremony held during the conference.

    About ON Semiconductor

    ON Semiconductor (Nasdaq:ON) is driving energy efficient innovations, empowering customers to reduce global energy use. The company is a leading supplier of semiconductor-based solutions, offering a comprehensive portfolio of energy efficient power management, analog, sensors, logic, timing, connectivity, discrete, SoC and custom devices. The company’s products help engineers solve their unique design challenges in automotive, communications, computing, consumer, industrial, medical, aerospace and defense applications. ON Semiconductor operates a responsive, reliable, world-class supply chain and quality program, a robust compliance and ethics program, and a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe and the Asia Pacific regions. For more information, visit http://www.onsemi.com.

    About Veeco

    Veeco (NASDAQ:VECO) is a leading manufacturer of innovative semiconductor process equipment.  Our proven MOCVD, lithography, laser annealing, ion beam and single wafer etch and clean technologies play an integral role in producing LEDs for solid-state lighting and displays, and in the fabrication of advanced semiconductor devices.  With equipment designed to maximize performance, yield and cost of ownership, Veeco holds technology leadership positions in all these served markets.  To learn more about Veeco's innovative equipment and services, visit www.veeco.com.

    Media Contact:                        Investors Contact:

    David Pinto                              Anthony Bencivenga

    408-325-6157                          516-677-0200 x1308

    dpinto@veeco.com                 investorrelations@veeco.com


 Products

  • LSA 101 Laser Spike Anneal System
    Industry Leading Millisecond Anneal Technology Offers Lowest Thermal Budget Solution. LSA is used for an increasing number of applications (FinFET, HKMG) as devices scale to smaller dimensions with different materials and architectures....

  • Utilized by leading IDMs and foundries around the globe
    > Veeco-Ultratech’s 300mm LSA101 system is utilized as the preferred technology for high-volume manufacturing of advanced logic devices from the 40nm to 10nm nodes with development at 7nm.
    > Built on the customizable Unity Platform[TM], the LSA’s scanning system has fundamental advantages in uniformity and low-stress processing, which make it readily applicable for current and future device nodes.
    > The LSA101 enables critical millisecond annealing applications that allow customers to maintain high processing temperatures, and thus achieve improved device performance, lower leakage, and improved yield.

    Laser Spike Annealing Technology Advantages
    > Veeco-Ultratech’s laser processing system provides solutions to meet the difficult challenge of fabricating ultra-shallow junction transistors with highly activated source/drain contacts
    > LSA provides a sub-millisecond thermal anneal process at temperatures up to 1350°C, resulting in high activation with minimal dopant diffusion
    > Proprietary optical design reduces pattern related within-die temperature variations by >10x as compared to other millisecond annealing systems

  • SUPERFAST 4G+ Wafer Inspection System
    Highest Productivity Patterned Wafer Inspection for HVM; Utilized by Leading Memory and Logic Fabs for Advanced Process Control....

  • Highest throughput patterned wafer inspection system
    > Provides the industry’s highest throughput for 300mm patterned wafers
    > Utilized by leading memory and logic fabs for advanced process control
    > Enables 100% inspection for feed-forward overlay distortion control and high-stress process control (bow, warpage, breakage)
    > 3D topography measurement data used for CMP uniformity and scanner focus control

     

    Key Superfast 4G+ Advantages
    > Front Side Pattern Wafer Measurement
    > High Resolution 
    > Lowest Edge Exclusion 
    > Displacement repeatability 

    Scanner Overlay Correction
    > Process induced in-plane displacement (IPD) can be minimized by process fingerprinting to determine critical process steps for process optimization
    > Remaining displacement error can be measured and applied as feed-forward overlay correction during scanner exposure

    Full Wafer and Local Topography Maps
    > Superfast can be used to predict local CMP planarization breakdowns that may cause localized scanner focus issues
    > Higher order polynomial and FFT fits can be applied to full wafer or to individual shots for mapping local topography
    Local Site Flatness and Line Scans
    > Site flatness maps can be used for correlation to scanner focus issues
    > Vertical line plots can be quickly generated for process development or in-line APC to quantify within-wafer and wafer-to-wafer variations
    Full Wafer Bow and Stress Measurements
    > Full patterned wafer bow measurements are easily made for in-line process control
    > Full wafer stress maps are available for identifying and monitoring of high-stress inducing process that can impact device yield

  • AP 200/300 Stepper for Advanced Packaging, RF/MEMS
    AP200/300 lithography systems deliver superior overlay, resolution & sidewall profile performance for highly-automated, cost- effective manufacturing. The systems are well suited for copper pillar, fan-out, TSV, silicon interposer & more....

  • Superior Operational Flexibility for Multiple Applications
    > World-class HVM proven platform with full automation, selectable exposure wavelength and universal wafer size capability (6 & 8-in or 8 & 12-in wafers)
    > Adjustable Numerical Aperture projection optics for maximum DoF in thick and thin resists with 0.8 to 2.0 μm minimum resolution
    > Backside or buried layer IR alignment option for advanced processes including interposers and TSVs

    Key AP200/300 Stepper Advantages
    > Broadband Projection Lens 
    > Variable NA for Enhanced Resolution and Large Depth-of-Focus
    > Wafer Edge Processing for Electroplating Processes
    > Highest Economic Value with Lowest Production Risk

    Warped Wafer Handling 

    > Expands process window and yield for warped wafers by reducing chucked wafer flatness 
     

    Full Wafer Mapping (Optical Focus)

    > Improves yield for smaller FOWLP feature sizes by providing full wafer topography map with ability to specify up to six locations per field for extremely accurate shot by shot focusing


    Variable NA Projection Optics
    > Enables high aspect ratio lithography, large depth-of-focus and high wafer plane irradiance for thick resist applications

    Sub 1μm Line/Space Resolution
    > Reduces cost of high connectivity packages and expands application space by significantly increasing overall I/O density


 Additional Info

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Please indicate which industries/technologies your company serves
LED/solid state lighting, MEMS, Other, Power Semiconductors, Semiconductor
If you checked Other, please indicate your Company Industry
Front-end Semiconductor, Compound Semiconductor, Photonics/VCSELs, Advanced Packaging

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