RECIF Technologies S.A.S

376 Business Park
7 Nancy Court, Suite 6
Wappingers Falls,  NY  12590

United States
  • Booth: 2017

RECIF Technologies, a world class equipment supplier supporting the leading edge wafer handling solutions, remains the premier innovator and benchmark in wafer sorting. RECIF's latest development of the COMPACT G5+ (sorters) and SMART platforms (sorters & EFEMs) are just two examples of newer products in a long line of successful tool models. With its 30+ years of experience, RECIF is acknowledged as a world leader in high value added robotics and handling solutions for the Semiconductor Industry.

We support wafer manufacturing at the most advanced nodes, from standard Si 300mm wafers to advanced packaging substrates (for 3D IC, FO-WLP).

Our commitment is to support our customers with high quality, innovative equipment designed to answer their productivity requirements as well as providing continuous improvement to their manufacturing process. RECIF COMPACT G5+ and SMART platform’s, meet the highest industry standards and customers’ expectations related to safety and Total Cost of Ownership.

In 2018, the SMART EFEM's introduction enables RECIF to expand its offer and to enter the OEM market.


  • COMPACT Sorter G5+
    COMPACT Sorter G5+, standard solution for 300mm silicon wafers sorting > Most optimal footprint ...

  • The COMPACT Sorter G5+ is the latest generation of 300mm COMPACT wafer sorters  from RECIF Technologies. Its innovative design offers a soft breakthrough thanks to its field proven modules and technologies such as real time filed bus, direct drive transmission and many other technical advances.

    It also provides the highest throughput ever achieved with a single robot, the smallest footprint and unsurpassed cleanliness demonstrated, as well as extremely secure wafer handling.

    The RECIF Technologies COMPACT wafer sorter G5+ 300mm is providing IC manufacturers the ultimate productivity solution for 10 nm nodes and beyond.

    Main features :

    • Vacuum free backside contact or edge contact end effector
    • On the fly wafer alignment
    • N2 purge capability on load ports
    • Industrial controller
    • Real time field bus and electronics
    • Single wafer flipper or single wafer buffer in dedicated casing option
    • 4LP in line can be integrated into stocker
    • Easy recipe creator software

    Further information available upon request

  • SMART EFEM and Sorter
    RECIF SMART EFEMs and sorters - the result of the SMART platform concept - support emerging applications such as 3D IC and advanced packaging. Adopting a modular approach, a common robotics core is interfaced with several loading stage and end effector....

  • The SMART range of products is the result of the SMART platform concept, developed by RECIF Technologies to support emerging applications. It addesses the challenges raised by new applications such as 3D IC and advanced packaging.

    Adopting a modular approach, a common robotics core is interfaced with several loading stage and end effector. The SMART products are available in Sorters and EFEMs.

    • 300mm advanced substrates EFEM / Sorter
      For standard 300mm silicon wafers, 3D IC (TSV / glass / stacks) & FO-WLP (mold compound / warped wafers)

    • 380mm frame EFEM / Sorter
      For 300mm wafers mounted on 380mm frames

    • 450mm advanced substrates EFEM / Sorter
      For standard 450mm silicon wafers, 3D IC (TSV / glass / stacks) & FO-WLP (mold compound / warped wafers)


    Further information available upon request

  • Vacuum Handling System (VHS)
    RECIF manufactures a complete range of Vacuum Handling Systems. The design incorporates organic materials, patented vacuum tip design and true ESD protection providing a unique system which meets the highest levels of cleanliness and safety....

  • RECIF Technologies history started in 1982 offering its first wafer handling solution: Vacuum Handling Systems.
    Based on this historical technical mastery, RECIF Technologies provides today a full range of single wafer manual vacuum handling solutions adapted to our customers’ and current Semiconductor industry’s’ requirements.

    Our Vacuum Handling Systems (VHS) range offers:

    • Patented vacuum tip design
    • Clean organic material use
    • A true ESD protection
    • the highest level of cleanliness and safety
    • Manual single wafer handling from 100mm to 450mm

    All parts of our Vacuum Handling System are interchangeable. They can be configured or upgraded to meet specific end-user requirements.

    • Angled versions of tips available (10°, 30°)
    • Optional ergonomic upgraded wand
    • Straight or coiled tubes

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MEMS, Power Semiconductors, Semiconductor, Sensors

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