131 Impasse Barteudet
Saint-Jeoire,  Haute-Savoie  74490

  • Booth: 6365

Discover SET high post-bond accuracy FLIP-CHIP BONDERS!

Founded in 1975, SET - Smart Equipment Technology - based in Saint-Jeoire, France, is a world leading supplier of High Accuracy Flip-Chip Bonders (Die-to-Die and Die-to-Wafer).

With more than 340 Device Bonders installed worldwide, SET is globally renowned for the unsurpassed accuracy and the flexibility of its Flip-Chip Bonders.

The SET Bonders adapt to all main bonding techniques: fluxless reflow, adhesive joining compression and thermosonic.

SET’s newest generation of bonder, the ACCµRA family, guarantees the highest bonding accuracy (± 0.5 µm) and quality for the most demanding applications: image sensors, 3D IC with high density TSV, MEMS and optoelectronics applications... 

SET encompasses a subsidiary in North America and offers a comprehensive product portfolio of Flip-Chip Bonders for fast growing markets and serving clients through a global network of representatives and in-depth customer trainings.

Discover our range of FLIP-CHIP BONDERS: ACCµRA100, ACCµRA OPTO, ACCµRA M and ACCµRA Plus!


  • ACCµRA100
    The ACCµRA100 is a semi-automatic flip-chip bonder that guarantees +/- 0.5 µm post-bond accuracy....

  • Its flexibility makes it ideal for developing a wide range of applications.

    The ACCµRA100 combines high precision, accessibility and cost-effectiveness.

    It is the perfect equipment for universities and R&D institutes.

  • ACCµRA M
    The ACCμRA M is a manual flip-chip bonder that allows ± 3 μm post-bond accuracy. This equipment permits to align manually the components with a high level of precision....

  • The motorized arm controls precisely the bonding force. Combining and synchronizing the arm with the temperature controller, it guarantees a perfect quality and high repeatability of your process.

    The ACCμRA M, more than a pick-and-place system, offers thermocompression and reflow capabilities.

    It is the perfect equipment for universities and R&D institutes.

  • ACCµRA Plus
    ACCμRA Plus is a flip-chip bonder designed for ± 0.5 μm accuracy in full automatic mode....

  • It is suitable for reflow and thermocompression processes.

    ACCμRA Plus combines high precision, flexibility and short cycle time.

    It is dedicated to production for Optoelectronic and Silicon photonics applications.

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