Dexerials America Corporation

2001 Gateway Place
Suite 455E
San Jose,  CA  95110

United States
  • Booth: 6160

Dexerials Corporation creates advanced materials for semiconductor applications by utilizing its unique set of materials, process solutions, and customized technology. Dexerials Corporation will showcase its Film type underfill (NCF) for 3D-IC back-end packaging and Thermal conductive sheets. Dexerials Corporation is continuously enhancing its cutting-edge materials and process technologies and is always focused on expanding the usage of these new technologies in other applications until the customer’s vision becomes a reality. For more information, please visit


  • Film type underfill (NCF) for 3D-IC assembly
    Non-conductive Thermal Compression Bonding film for 3D-IC/Chip packaging....

  • The NCF allows for a reliable package, void-free with good solder joints. It also offers optimized viscosity and thickness in addition to precise control of flow volumes of NCF along the edge of the chip. Applications include 3D-IC packaging with TSV-chips such as Chip on Chip and Chip on Wafer. 
  • Thermal conductive sheet
    Thermal conductive sheets rapidly convey the large volumes of heat to a heat sink to prevent devices from overheating....

  • Our silicone type thermal conductive sheets feature high thermal conductivity and flexibility while our acrylic type does not generate low molecular weight siloxanes (which causes contact failure in electronic devices). Our material mixture gives excellent flexibility to the acrylic type, which has higher thermal conductivity and durability com­pared to the generic acrylic sheets. Adding to the existing lineup is our carbon fiber type, with extremely high thermal conductivity of over 30 W/ (m • K), which is an ideal fit for thermal countermeasures in high performance CPUs and power ICs. 

 Additional Info

New Exhibitor:
New Products:
Displaying Equipment:
Product Demonstrations:
Please indicate which industries/technologies your company serves
LED/solid state lighting, MEMS, Other, Plastic/organic/flexible electronics, Power Semiconductors, Semiconductor, Flexible and Printed Electronics-, Sensors
If you checked Other, please indicate your Company Industry
5G Electronics

Send Email

Type your information and click "Send Email" to send an email to this exhibitor. To return to the previous screen without saving, click "Reset".

For Technical Support with this webpage, please contact support.