July 12-14, 2016
San Fransisco, CA
E+H Metrology offers a complete line of Wafer Geometry, Resistivity and Stress measurement systems. Wafers up to 450mm can be measured on manual gauges or fully-automated robotic or belt sorters using advanced software. Thickness, Flatness, Bow, Warp, Stress and wafer Resistivity can all be measured in a single high-throughput wafer sorter using the advanced E+H MX-NT operating software. E+H's proprietary WAFERSTUDIO offers unique 3D visualization and analysis. The E+H manual gauges and automated sorters will reliably measure thin and thick wafers for all processes including Si, PV, LED, GaAs, SiC, Sapphire and semi-insulating materials. The mature design of our Metrology Tools lowers your maintenance costs and provides extreme uptime. The contactless hybrid sensor technology metrology focuses tightly on your application, eliminates unnecessary "bells and whistles" to maximize throughput & reliability and to minimize tool cost.