July 12-14, 2016
San Fransisco, CA
Dexerials Corporation creates advanced materials for semiconductor applications by utilizing its unique set of materials, process solutions, and customized technology. Dexerials Corporation will showcase its Film type underfill (NCF) for 3D-IC back-end packaging and Thermal conductive sheets. Dexerials Corporation is continuously enhancing its cutting-edge materials and process technologies and is always focused on expanding the usage of these new technologies in other applications until the customer’s vision becomes a reality. For more information, please visit https://www.dexerials.jp/en/.