ETEL developed a new positioning platform, called TELICA, dedicated to the semiconductor back end processes as well as the electronic market. It allows to cope with the requirements of next generation advanced packages with a placement accuracy in the µm range, over a working space of up to 870 x 800 mm, allowing very high duty cycles and throughput.
The mechanical architecture of the TELICA platform is a dual gantry motion system moving in X, Y and Z directions.
The powerful ironcore linear motors are water cooled to allow extremely high duty cycles, high accelerations up to 80 m/s2, while ensuring thermal stability, resulting in outstanding placement accuracy.
The TELICA platform integrates the revolutionary concept of the Moving Metrology Frame (MMF). It acts as a dual position feedback loop allowing the correction of the placement accuracy with no compromise on the throughput. The MMF is the holy reference along the bonding process, whatever working state the machine is in.