July 12-14, 2016
San Fransisco, CA
World leading laser application system design & manufacturing company since 1989. Specialized in custom design & manufacturing standard semiconductor & solar industries laser processing tools.LASER WAFER GROOVING & DICING (LMC2000/3000/3200): 100% laser grooving & dicing system for all wafer size up to 300mm. LASER WAFER LEVEL PACKAGE MARKINH (CSM2000/3000/3002): 100% fully automatic WLP backside laser marking for any wafer sizes or wafer ID marking up to 300mm. LASER SCRIBING & DELETION (TSFR, TFEDR, TFS series): 100% laser scribing & edge deletion/isolation system for solar industries up to 8.5th Generation panel sizes. Laser MARKER: Etching & engraving products ID, 2D marking, logo & other products information on semiconductor chips, metal packages or electronics products. Newly introduced LOW-HIGH POWER LASER SOURCE also available for customized laser processing tools in semiconductor & solar industry.