· Die sizes up to 50mm square.
· 0.5 micron placement accuracy. (+/-0.5 micron depending on application).
· Magnification up to 800x.
· Viewable area 50mm square (with optional X-Y motorized viewer).
· New fail safe bond head design and efficient heater.
· Stages 50mm & 100mm square standard. (other sizes and shapes available).
· Stage temperatures to 450º C (depends on stage selected).
· Temperature ramp rate for 50mm rapid heat. stage is 20º/sec. Cover gas included.
· Bond head temp to 400º C. (depends on bond head selected).
· Bond load 10g to 10Kg (depends on bond head selected).
· Precision hot gas to 650º C for spot heating.