Hangzhou Freqcontrol Electronic Technology Ltd.

#1106, Crystal International Business Center (CIBC)
No.198 Wuxing Rd. Qianjiang New City
Hangzhou,  Zhejiang Province  310006

China
http://www.csimc-freqcontrol.com/
  • Booth: 6464


Welcome to Hangzhou Freqcontrol Electronic Technology Ltd.

Our company is a leading Chinese manufacturer who involves in piezoelectric crystals , surface acoustic wave filters and the single crystal growth as well as substrates process which for use in the telecommunications and general time and frequency industries.
we are able to supply a very broad range of high precision single quartz blanks with different orientations ;  lithium Niobate and lithium Tantalate substrates (3”,4”6”&8”) for RF saw filters picked RF Module for smart mobile  and Custom sized glass substrates for Optical windows as well as commercial-end frequency controlled component at BULK and SAW industry for 3G,4G,and 5G application .
We has been servicing for microelectronic manufacturers, defense related contractors, National laboratories, universities and scientists around the world since 1990 . 
From 2007 marked our continued expansion with the addition of LN ,LT ,QTZ  substrate on  3” , 4” , 6” & 8”  with the most thin at 0.1-0.15 mm which will make chips to be possible packed within smallest packages.
  Up to 2010 years, we developed production capability to different kind of glass substrates up to 12” to apply for semiconductor and optical industry.


 Press Releases

  • Our abundance experience at growing and mass production for SAW grade Lithium Tantalate. We are equipped with advanced facilities at Crystal growing, wafer lapping, polishing and checking, all finished products are passed at Testing of curie Temp and QC inspection. 

    Our R&D is active at developing and researching from new material to finished products at all kinds of optical doped wafers & electronic components. 

    Material  LiTaO3 LiNbO3 wafers(White or Black 
    Curie Temp 603±2℃
    Cutting Angle X/Y/Z/X112Y/Y36/Y41/Y42/Y48/Y64/Y128etc
    Diameter/size 3”/4”/6" LN/LT wafer  8" LN wafer under develop
    Tol(±) <0.20 mm
    Thickness 0.18 ~ 0.5mm or more
    Primary Flat 22mm /32mm /42.5mm /57.5mm
    LTV (5mmx5mm)  <1µm
    TTV  <3µm
    Bow -30<bow<30
    Warp <40µm
    PLTV(<0.5um) ≥95%(5mm*5mm)
    Orientation Flat All available
    Surface Type Single Side Polished /Double Sides Polished
    Polished side Ra <0.5nm
    Back Side Criteria General is 0.2-0.5µm or as customized
    Edge Criteria R=0.2mm or Bullnose
    Wafer Surface Criteria Transmissivity general:5.9x10-11<s<2.0*10-10 at 25℃
    Contamination, None
    Particles ¢>0.3 µ  m <= 30
    Scratch , Chipping None
    Defect No edge cracks, scratches, saw marks, stains
    Packaging Qty/Wafer box 25pcs per box 
  • Our abundance experience at growing and mass production for piezo grade quartz . We are equipped with advanced facilities at Crystal growing, wafer lapping, polishing and checking. 

    Our R&D is active at developing and researching from big material to process 8” quartz wafer or more.

    Material Quartz Crystal
    Cutting Angle X/Y/Z/AT32、33、36/BT/ST42.75°-cut etc
    Diameter/size 3”(76.2mm) 4” (100mm) 6"(150mm) 8"(200mm)
    Tol(±) <0.20 mm
    Thinnest Thickness 0.08mm  Min 0.10mm  Min 0.20mm Min   0.35mm or more
    Primary Flat 22mm  32mm  42.5mm  57.5mm
    LTV (5mmx5mm)  <1µm
    TTV  <3µm
    Bow -30<bow<30
    Warp <40µm
    PLTV(<0.5um) ≥95%(5mm*5mm)
    Orientation Flat All available
    Surface Type Single Side Polished /Double Sides Polished
    Polished side Ra <0.5nm
    Back Side Criteria General is 0.2-0.5µm or as customized
    Edge Criteria R=0.2mm or Bullnose
    Material Property ECD Better than grade 4
    Inclusion Better than grade II
    Q-Value Better than grade C
    Wafer Surface Criteria Particles ¢>0.3 µ  m <= 30
    Scratch , Chipping None
    Defect No edge cracks, scratches, saw marks, stains
    Packaging Qty/Wafer box 25pcs per box 
  • CQT uses a variety of glass and quartz depending on the application and material requirements. Our designers and engineers are skilled at working with any number of glass and quartz materials to machine and fabricate precision optical products such as fused quartz parts for optics, fused silica parts used in fiber optic applications, and borosilicate glass parts found in semi-conductor manufacturing.

    The general specs are as follows sheet, if your specified is not included with it, you may freely tell us and we’ll pleased to customize them for you.

    spec unit 4" 6" 8" 10" 12”
    Diameter/size(or square) mm 100 150 200 250 300
    Tolerance (±) mm 0.2 0.2 0.2 0.2 0.2
    Thickness mm 0.10 or more 0.30 or more 0.40 or more 0.50 or more 0.50 or more
    Primary reference flat mm 32.5 57.5 Semi-notch Semi-notch Semi-notch
    LTV (5mmx5mm) µm < 0.5 < 0.5 < 0.5 < 0.5 < 0.5
    TTV µm < 2 < 3 <3 <5 <5
    Bow µm ±20 ±30 ±40 ±40 ±40
    Warp µm ≤ 30 ≤ 40 ≤ 50 ≤ 50 ≤ 50
    PLTV(5mm*5mm)<0.4um % ≥95% ≥95% ≥95% ≥95% ≥95%
    Edge Rounding mm Compliant with SEMI M1.2 Standard/refer to IEC62276
    Surface Type Single Side Polished /Double Sides Polished
    Polished side Ra nm ≤1
    Back Side Criteria µm general 0.2-0.7 or customized

    Material included: Series Glass: Borofloat33/B270/D263/BK7 etc. 

    Series Glass: Eagle XG , Fused Silica 7980/7978/7979 etc. 

    Series Glass: Fused Silica JGS1/JGS2 & Single quartz etc.

    Series Glass: H-K9L glass/ Soda Lime etc. 

    Process capability:

    Item Capability
    Diameter 5mm - 400mm
    Thickness 50μm or  more
    Dimensional Tolerance +/- 25μm
    Thickness Tolerance +/- 5μm
    Thickness Variation(TTV) < 2μm
    Flatness 1/10 Wave/Inch
    Surface Roughness (RMS) <5Ǻ
    Scratch and Dig 10/5
    Particle Size <10μm
    Bow/Warp <10μm

 Additional Info

New Exhibitor:
Yes
New Products:
Yes
Displaying Equipment:
No
Product Demonstrations:
Yes
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MEMS, Other, Semiconductor, Sensors

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