July 12-14, 2016
San Fransisco, CA
World leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, Hesse Mechatronics designs and manufactures high speed fine pitch/thin wire wedge bonders, heavy wire bonders and complementary equipment for semiconductor backend assembly, in addition to providing wire bonding services.
Wire Bonding Equipment
Hesse Mechatronics' high-speed, fully automatic wedge bonders handle both light and heavy wire applications with aluminum and gold round wire from 12.5 micron (.0005) to 500 microns (.020) in diameter, in addition to ribbon wire from 6 x 35 microns up to .3 x 2 mm, including HCR™ (High Current Ribbon).
Wire Bonding Services
The company's wire and ribbon bonding services support early stage product development including heavy wire and ribbon bonding process support, development and production of prototypes and pre-production manufacturing in four applications and demonstration labs throughout the USA.
Wire Bonding Videos
Register to view our wire bond videos at www.wirebonddemo.com