July 12-14, 2016
San Fransisco, CA
We provide a full range of metrology solutions
Since 1988 Frontier Semiconductor (FSM) provides a full range of advanced metrology products for many key semiconductor process steps:
Unique optical, non-contact Thickness Measurements of Substrates and Layers in back-grinding and back-etching application.
Film Stress and Adhesion measurement equipment for thin film deposition and oxidation, metallization. Unique capabilities include film stress mapping and process characterization at temperatures up to 900 degrees.
Metrology for Through Silicon Via (TSV) creation and copper reveal
Contact and non-contact Sheet Resistance Measurement for ion implantation, doping, metallization.
Die level warp and bow measurement for die stacking.
Micro-Raman measurements for stress control in advanced nano device and 3D packaging structures.
Film Stress Measurement at room temperature
Film Stress Measurement at high temperature up to 900C
Sheet Resistance Measurement
Thin Film and Thick Layer Thickess and Topology Measurement
With a sales and service structure around the world we guaranty optimal support for our global customers.