Like many sealing applications, contamination is the enemy of precision sealing performance. In typical industrial sealing applications, contamination is measured in millimeters, in the semiconductor industry it is measured in microns.
Cirlex® is the perfect material for precision sealing applications under extreme chemical, temperature, and pressure applications. It is available in 0.001” increments in thickness, is a dead-flat material, and has excellent compression resistance. Cirlex® exhibits almost no mechanical deformation between cryogenic (-269°C) and extreme heat (220°C). And as a polyimide, it will not melt or stick to silica/aluminum wafers.
This pursuit of environmental purity causes unique semiconductor sealing challenges. The semiconductor manufacturing process is extremely aggressive and seals are invariably housed in areas of the processing system where they need to withstand highly corrosive liquids, gases and plasmas often at elevated temperatures or in vacuum conditions.
Fralock is a leading developer and manufacturer of high performance precision sealing options and we work together with you, our customer, to establish the optimum seal material and design to maximize the performance of your semiconductor manufacturing equipment. Traditional elastomers don’t stand a chance in these environments.
To meet these challenges materials such as Cirlex® provide exceptional performance. This custom composite will perform where other traditional materials fail, and extend planned maintenance schedules that maximize equipment up-time and increase total cost of ownership.
Consult Fralock engineers on your OEM or aftermarket semiconductor sealing application.
***CIRLEX® is a registered trademark of DUPONT used under license by FRALOCK. For additional information about us or to begin discussions on your project call 1-800-FRALOCK (372-5625) or Request a quote online.