3D-Micromac AG

Technologie-Campus 8
Chemnitz,  D-09126

Germany
http://www.3d-micromac.com
  • Booth: 5762

3D-Micromac AG - Micromachining Excellence
3D-Micromac is the leading specialist in laser micromachining. Our team of experts develop processes, machinery and complete systems at the highest technical and technological level. 3D-Micromac systems and services have been successfully implemented in various high-tech industries worldwide including photovoltaic, semiconductor, glass and display industries, micro diagnostics, and medical technology. Our target is to completely satisfy customer demands even on the most complex projects.

3D-Micromac adheres to high-performance and future-oriented processes at high production efficiency. Our technologies have set international standards for true innovation.

Our subsidiary:

3D-Micromac America, LLC
2151- 40 O’Toole Ave
San Jose, CA 95131
USA
Email: sales@3d-micromac.com


 Press Releases

  • 3D-Micromac AG expands its service portfolio with the job shop manufacturing in the field of industrial laser micro machining

    Chemnitz, May, 10, 2019 - 3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, medical device and electronics markets, is adding laser contract manufacturing to its portfolio. With this strategic step, 3DMicromac intends to deepen the connectivity with existing and new customers in the development of new laser processing technologies for industrial manufacturing.

    "We want to respond to the increasing number of inquiries from customers who do not need their own laser equipment, for example in the field of smallbatch production. This gives us the great opportunity to work together with our customers on new solutions and to develop the right machine concepts. In addition, we can greatly expand our know-how and deepen our expertise," says Uwe Wagner, CTO at 3D-Micromac.

    Contract manufacturing is carried out exclusively on the laser machines of 3D-Micromac. Depending on the requirements, industrial laser systems as well as versatile development systems are available in 3DMicromac’s application and service center. In combination with various beam sources from the leading laser manufacturers as well as the unique process expertise, 3D-Micromac manufactures high-quality components. Production efficiency and cost awareness are the top priority.

    More information on contract manufacturing as well as some impressions on the processing results are available on www.lasermicroprocessing.com.

    About 3D-Micromac

    Founded in 2002, 3D-Micromac AG is the industry leader in laser micromachining, delivering powerful, user-friendly and leading edge processes with superior production efficiency. We develop processes, machines and turnkey solutions at the highest technical and technological level. 3D-Micromac systems and services have been successfully implemented in various hightech industries worldwide including photovoltaic, semiconductor, glass and display industries, micro diagnostics, and medical technology.

    For more information, visit the company’s website at http://www.3d-micromac.com.

    Contact:

    3D-Micromac AG
    Mandy Gebhardt
    Team Leader Marketing and Public Relations
    Tel: +49 371 40043-26
    E-Mail: gebhardt@3d-micromac.com

  • 3D-Micromac presents its microSHAPE laser systems at Laser World of Photonics 2019

    3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets, presents its microSHAPE laser systems for processing large and flat substrates at Laser World of Photonics 2019, taking place from June 24 to 27 in Munich, Germany.

    The modular microSHAPE platform is used in all applications where highly dynamic laser processing with precision requirements in the micrometer range on substrates up to 2,000 × 6,000 mm in size are to be realized. Applications include structuring and cutting of glass, surface modifications or structuring of metal substrates as well as the production of printing plates and embossing tools.

    The microSHAPE axis system can be flexibly adapted to the application and can be configured to match the process in terms of performance or dynamics. Depending on the configuration level, axis speed of up to 1.5 m/sec., acceleration of 1.5 g and a repeating accuracy of ±1 μm can be achieved. Depending on the application, different beam deflection systems and laser sources can be integrated. For highefficient processing, high power nanosecond or picosecond lasers are used in combination with highly dynamic 2D / 3D galvanometer scanners or with polygon scanners.

    The substrates are inserted and removed in a specially developed handling system, which supplies the substrates semi-automatically or fully automatically to the laser unit.
    If required this can also be done largely without surface contact. The high-precision alignment of the substrates as a standard is realized automatically. Height variations of the substrates can be easily compensated either by adapted beam shaping or by tracking of the laser focus. 3D-Micromac’s user-friendly machine software processes customer layouts quickly and controls the complete machining process.

    Media, analysts and potential customers interested in learning more about 3D-Micromac’s laser systems, including microSHAPE, are invited to visit the company at Laser World of Photonics 2019, June 24-27 at the New Fair Munich in Hall A2, booth #129.

    More information is also available on https://3d-micromac.com/laser-micromachining/products.

    About 3D-Micromac

    Founded in 2002, 3D-Micromac AG is the industry leader in laser micromachining, delivering powerful, user-friendly and leading edge processes with superior production efficiency. We develop processes, machines and turnkey solutions at the highest technical and technological level. 3D-Micromac systems and services have been successfully implemented in various hightech industries worldwide including photovoltaic, semiconductor, glass and display industries, micro diagnostics, and medical technology.

    For more information, visit the company’s website at http://www.3d-micromac.com.

    Contact:

    3D-Micromac AG
    Mandy Gebhardt
    Team Leader Marketing and Public Relations
    Tel: +49 371 40043-26
    E-Mail: gebhardt@3d-micromac.com

  • Enhanced module power gain by thermal laser separation for solar cell separation compared to scribe and break technology

    3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets, today announced that the total received order volume for its microCELL TLS high-throughput half-cell cutting tools tops 3 GW in 2019.

    The microCELL TLS systems use Thermal Laser Separation for separation of standard silicon solar cells into half-cells. The ablation free process guarantees an outstanding edge quality. The separated cells show an approximately 30% higher mechanical strength. By using Thermal aser Separation, module manufacturers are enabled to guarantee a lower power degradation value over lifecycle of the solar module. Furthermore, a module power gain of 1-2 W was seen with TLS compared to conventional scribe and break methods, in addition to the 5-7 W per module gain of half-cell module technology.

    Media, analysts and potential customers interested in learning more about 3D-Micromac’s laser systems for silicon solar cell and flexible photovoltaic, including microCELL TLS, are invited to visit the company at SNEC 2019, June 4-6 at the Shanghai New Int’l Expo Center in Hall N3, booth #111.

    More information on microCELL is also available on https://3dmicromac.com/laser-micromachining/products/microcell/.

    About 3D-Micromac

    Founded in 2002, 3D-Micromac AG is the industry leader in laser micromachining, delivering powerful, user-friendly and leading edge processes with superior production efficiency. We develop processes, machines and turnkey solutions at the highest technical and technological level. 3D-Micromac systems and services have been successfully implemented in various hightech industries worldwide including photovoltaic, semiconductor, glass and display industries, micro diagnostics, and medical technology.

    For more information, visit the company’s website at http://www.3d-micromac.com.

    Company Contact:

    Mandy Gebhardt
    Manager, Marketing and Public Relations
    3D-Micromac AG
    Tel: +49 371 40043-26
    E-Mail: gebhardt@3d-micromac.com

    Agency Contact:

    David Moreno
    Vice President
    MCA, Inc.
    Tel: +1.650.968.8900, ext. 125
    E-Mail: dmoreno@mcapr.com


 Products

  • microDICE™
    TLS-Dicing™ System for Separation of Silicon and Silicon Carbide Wafers...

  • The microDICE™ laser micromachining system leverages TLS-Dicing™ (thermal laser separation) – a unique technology that uses thermally induced mechanical forces to separate brittle semiconductor materials, such as silicon (Si), silicon carbide (SiC), germanium (Ge) and gallium arsenide (GaAs), into dies with outstanding edge quality while increasing manufacturing yield and throughput. Compared to traditional separation technologies, such as saw dicing and laser ablation, TLS-Dicing™ enables a clean process, micro-crack-free edges, and higher resulting bending strength.

    Capable of dicing speeds up to 300mm per second, the microDICE™ system provides up to a 10X increase in process throughput compared to traditional dicing systems. Its high throughput, outstanding edge quality and 300-mm wafer capable platform enables a true high-volume production process, especially for SiC-based devices.

    In addition, microDICE™ reduces the dicing cost per wafer by up to an order of magnitude or more compared to other wafer dicing approaches. Due to the contactless laser machining method, there is no tool wear and no expensive consumables are required. This results in up to 15X lower cost of ownership over the entire life-time of the dicing system. microDICE™ also offers the ability to produce more dies per wafer by reducing the street width.

    Highlights:

    • Significant higher throughput due to dicing speed up to 300 mm/s
    • Minimal cost of ownership
    • The ability to produce more dies per wafer by reducing street width
  • microPRO™ RTP
    Selective Laser Annealing System for Semiconductor Applications...

  • The microPRO™ RTP, a new laser annealing system designed to enable several key process steps in semiconductor, power device and MEMS manufacturing, combines a state-of-the-art laser optic module with 3D-Micromac’s modular semiconductor wafer manufacturing platform. It provides selective annealing with high repeatability and throughput in a versatile system.

    The microPRO™ RTP features a line scan option for vertical selective annealing and a step-and-repeat spot option for horizontal selective annealing, as well as three optional laser wavelengths.

    Highlights:

    • High flexible, high-quality laser annealing platform with high precision in both X and Y directions
    • High selectivity to different substrates and films, with multiple options for pulse length, puls energy and overlap (ensures no damage to the area surrounding the target site)
    • Very high energy homogeneity
    • Precise monitoring of both the laser and process
  • microPREP™
    Laser-Based Sample Preparation for Microstructure Diagnostics...

  • The all-new microPREP™ system was developed to provide efficient laser sample preparation fitted to the needs of microstructure diagnostics and failure diagnostics.

    The modular software design of microPREP™ ensures high flexibility for machining of samples for a broad range of microstructure diagnostics techniques. Besides the provision of recipes and the capability to mark samples for easy tracking, this novel approach features three orders of magnitude higher ablation rates in comparison to purely ion-beam-based processes.

    microPREP™ is suitable for transmission electron microscopy, X-ray microscopy (XRM), atom-probe tomography, transmission Kikuchi diffraction, and micromechanical testing. In addition to the microPREP™ platform for small-scale and R&D applications, 3D-Micromac offers the microPREP™ PRO platform for high-volume sample preparation applications, which includes the ability to create complex and 3D-shaped samples to enable more comprehensive analysis of certain structures in advanced packages, such as through silicon vias (TSVs), or even complete systems-in-package (SiP).

    Highlights:

    • Shorter time to sample: up to 10,000 times faster than FIB
    • Up to an order of magnitude lower cost of ownership
    • High degree of automation due to recipe-based, ergonomic user interface
    • Virtually no structural damage and no elemental contamination by ps laser processing
    • Providing larger-sized samples with micron-level precision
    • Enables the creation of samples with complicated/3D shapes (TSVs, SiP)
    • Meets the essential requirements of the SEMI S2/S8

 Additional Info

New Exhibitor:
No
New Products:
Yes
Displaying Equipment:
No
Product Demonstrations:
No
Please indicate which industries/technologies your company serves
MEMS, Other, Photovoltaic, Power Semiconductors, Semiconductor
If you checked Other, please indicate your Company Industry
3D-Micromac is a mechanical engineering company specialized in laser micromachining.

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