INNNO GLOBAL supplies various Test Sockets and Interposers.
INNO GLOBAL service to meet customer’s satisfaction.
PiS(Pin in Silicone) Technology applied for test Socket to Memory & Logic Test Socket (DRAM, LPDDR, Flash Memory, CPU, GPU, ect)
Various types of semiconductor packages test possible socket (BGA, MLF, QFN, QFP, CSP, etc)
* High frequency Logic and Memory PKG test available : over 20 Ghz
* Application pitch : 0.2mm and over
* Customized design under the divers request
An interposer is an electrical interface routing between one socket or connection to another.
a. High Speed interposer : High speed interposer, compatible with existing Rubber interposer
* High frequency test available : over 20 Ghz
* Application pitch : Over 0.4mm
* No PCB pad scratch or damage
* No need to C.O.K. modification
* Customize height
b. Spring Interposer : Integral pin design interposer
* Stable contact hot & cold tests
* Stable resistance and force
* Application pitch : Over 0.5mm
* Module base design – save install time