July 12-14, 2016
San Fransisco, CA
MicroSense - Precision Wafer Measurement Systems
300mm MRAM Wafer Magnetic Metrology
MicroSense offers a full suite of MRAM magnetic metrology tools that characterize the magnetic properties of multi-layer 300 mm wafers used in the fabrication of Perpendicular STT-MRAM.
MicroSense UltraMap – The New Standard for 200mm Polished Wafer Flatness Measurement
The new MicroSense UMA-C200L wafer metrology system measures the flatness, thickness and shape of bare 200mm silicon wafers with industry leading throughtput, 32% higher than legacy systems. The UltraMap system provides -
Thin Film Stress Measuremnt System - UMA-C200-STR
The MicroSense UltraMap UMA-C200-STR 200mm wafer measurement system provides full wafer maps of local stress for thin film despostion process control.