NANOTECH Inc.

261-1 Daeji-ro Suji-gu
Yongin-si, Gyeonggi-do,  16882

Korea (South)
http://www.nanotek.com
  • Booth: 6455


Welcome to Nanotech, Inc. at booth #6455.

Nanotech Inc. is sensor manufacturing company, located in South Korea.

Our products and services include optical emission spectroscopy, end point detectors and plasma monitors, film thickness measurement tools and application S/W used for the process control in semiconductor manufacturing.

We developed the plasma generating and spectrum analysis techniques for the 1st time in Korea, which was very much demanded technology in the semiconductor manufacturing process. We are proud to say that our technological strengths have been proven through 18 patents registered already and 4 under process.

Here in 2019 Semicon West, we would like to show you our SPOES, for leak detection and EPD for end point detection in the semiconductor manufacturing process. 


 Products

  • SPOES
    Self-Plasma Optical Emission Spectroscopy (Leak Detection, End Point Detection, Source Monitoring, Process Monitoring)...

  • Customer Benefits
    √ Technical expertise, all products developed our own technology
    √ Continuous upgrade in the application in response to customer feedback
    √ H/W, S/W customization options available to fit customer needs

     

       1. Application
        - PVD, (PE)CVD, (PE)ALD, Etcher,  all TM @semiconductor/display manufacturing
        - Ti TM/PM, W PM, WN TM/PM/Ex, TSN TM, C&C(Si etch) TM, OxALD PM, Diffusion PM
        - In-situ leak detection
        - ALD Source monitoring
        - Dry cleaning endpoint optimization
        - Process fault detection
        - In-situ fault detection caused by any chamber condition’s changes
        - Necessary in-situ gas monitoring to prevent unexpected process accident
       2. Features
        - RF plasma ignition : 0mT~10Torr
        - In-situ monitoring for 200~850nm
        - Use highly sensitive CCD sensor(2,048pixels)
        - Advanced EPD algorithms : Fine leak detection algorithm, Life time management
      3. SPOES vs. RGA (in CVD/ALD/Etcher processes)
    SPOES
    Features
    RGA
    0mT~10Torr
    Pressure range
    < 5x10-3Torr
    Good
    In-situ monitor
    Impossible because of damaging
    from reactant gases such as F, Cl
    No need
    Additional pumping
    Need
    No need
    Internal filament
    Need
    Possible
    Self cleaning
    Impossible
    Window & Tube (>1 year)
    Maintenance parts (Period)
    Filament (< 3 months)
    Operating Principles
    Specification
    Category
    Item
    Description
    Pressure Starting Pressure of Discharge 0mT~10Torr
    Composition Detectors / Controller 1~4 (Max. 12)
    Optic CCD Sensor 2048 pixels / 16bits
    Spectral Range 200~850nm (UV to NIR)
    Optical Resolution <±0.5nm
    Integration Time Min. 7ms
    Scan Time (Interval Time) Min. 50ms
    Optical Window Sapphire
    Power CCD Plasma Source Power Max. 30W
    Power Requirement 3.5A/12VDC
    Operation Operating System Windows XP, Windows7
    Software AOS (AEGIS Operating Software)
    Communication Ethernet
    Protocol TCP/IP, SECS, SECSII/GEM, SSCP
    Customiztion options available
    Mechanic Additional Pumping N/A
    Vacuum Interface ISO NW25 (Reducer Available)
  • EPD.OES
    This is our EPD(End Point Detection)/OES(Optical Emission Spectroscopy) solution designed for detecting endpoint and monitor process state change in the semiconductor and display manufacturing using plasma spectroscopy technology....

  • Customer Benefits

    √ Control the process accurately and stably
    √ Improve production yield-rate
    √ Respose to the changes of process promptly
    √ Available optimized solution for H/W or S/W to detect an endpoint

     

    Application

    √ End Point Detection, Process fault Detection
    √ Dry etcher/Asher/PECVD @Semiconductor/display manufacturing
    √ Increase throughput by determining the optimal etch time
    √ Detect process endpoint through in-situ monitoring optical change in the plasma chamber

     

    Features

    √ In-situ monitoring for 200~850nm
    √ Use highly sensitive CCD sensor(2,048pixels)
    √ Advanced EPD algorithms : Differential threshold method, Window method

     

    Operating Principles
    Specification
    Category
    Item
    Description
    Composition Detectors / Controller 1~ 7ch, Max.12 (Available More Addition)
    Optic CCD Sensor 2048 pixels / 16bits
    Spectral Range 200~850nm (UV to NIR)
    Optical Resolution <±0.5nm
    Integration Time Min. 7ms
    Scan Time (Interval Time) Min. 50ms
    Optical Fiber SMA905 type Connector, 4m
    Condensing Lens Module (Optional)
    Electric Power Requirement 0.8A/12VAC
    Operation Operating System Windows XP, Windows7
    Software AOS (AEGIS Operating Software)
    Communication Ethernet
    RS232, Digital I/O (Optional)
    Protocol TCP/IP, SECS, SECSII/GEM, SSCP
    Possible to modify and develop by customer’s request
    Mechanic Material (Body) Anodized Aluminum
    Dimension 103(W) x 54(H) x 137(D) mm
    Weight ~1.2kg
    Viewport Interface Optionally Provided According to Customer’s Request or Equipment
  • 2PM (Pulsed Plasma Monitor)
    Pulsed plasma, Plasma shape, Plasma arc, Tool-tool matching...

  • Customer Benefits

    √ Improve production yield-rate
    √ Separate sensing, not affect the process
    √ Optimized solution for HW/SW to detect plasma fault
    √ Easy and simple to build in low cost

    System Configuration

    Specification
    Category Item Description
    Optic
    Lens Module 2” Optics
    Sensor Si Photodiode
    Spectral Range 350~1100nm
    Electric
    Pulse Frequency Measuring Range 1~20kHz
    Time Resolution 1μs
    A/D Resolution 16bit
    Sensor Rising Time 10ns
    Sensor Active Area 13㎟ (3.6 x 3.6mm)
    Power Input 220VAC (via Power Adapter)
    Power Requirement DC7V 7W
    Connector (4pin Tiny QG) Male Connector, DSP Board Power Supply
    Connector (Ethernet TCP/IP) 10 Base-TX/100 Base-TX RJ-45 Interface 1 port, cable auto detect
    Mechanic
    Material (Body) Anodized Aluminum
    Dimension 108(W) x 110(H) x 140(D) mm
    Weight ~0.9kg
    Software
    O/S Microsoft Windows (.Net Framework 4.0)
    Sensor Connection Count 1 ~ 2
    Function Rising/Falling Time, Pulse-on/off Time, Period, Frequency,
    Peak/Average Value etc

 Additional Info

New Exhibitor:
Yes
New Products:
Yes
Displaying Equipment:
Yes
Product Demonstrations:
No
Please indicate which industries/technologies your company serves
Semiconductor, Sensors

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